Placement of Integrated Circuits for Reliability on Conductively Cooled Printed Wiring Boards.
| dc.contributor.author | Osterman, M.D. | en_US |
| dc.contributor.author | Pecht, M. | en_US |
| dc.contributor.department | ISR | en_US |
| dc.date.accessioned | 2007-05-23T09:39:19Z | |
| dc.date.available | 2007-05-23T09:39:19Z | |
| dc.date.issued | 1987 | en_US |
| dc.description.abstract | This article presents a mathematical theory for component placement for reliability based on the thermal response of conductively cooled printed wiring board. Placement procedures based on the theory are then developed and a general placement methodology is discussed. | en_US |
| dc.format.extent | 543708 bytes | |
| dc.format.mimetype | application/pdf | |
| dc.identifier.uri | http://hdl.handle.net/1903/4686 | |
| dc.language.iso | en_US | en_US |
| dc.relation.ispartofseries | ISR; TR 1987-181 | en_US |
| dc.title | Placement of Integrated Circuits for Reliability on Conductively Cooled Printed Wiring Boards. | en_US |
| dc.type | Technical Report | en_US |
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