PERFORMANCE OF LINK SLAB USING ECC AND UHPC

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dc.contributor.advisorFu, Chung C.en_US
dc.contributor.authorLi, Naiyien_US
dc.contributor.departmentCivil Engineeringen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.date.accessioned2019-06-20T05:37:58Z
dc.date.available2019-06-20T05:37:58Z
dc.date.issued2019en_US
dc.description.abstractConventional bridge design has been challenged by durability and reliability issues due to expansion joints. Chloride-contaminated infiltration and debris accumulation in traditional expansion joints affect the bridge performance negatively. Link slab has emerging as an effective alternative in bridge rehabilitation and design by eliminating expansion joints while the bridge structure remains simply supported. Engineered Cementitious Composites (ECC) and Ultra-High Performance Concrete (UHPC) are desired material in link slab application due to their high strength and tensile ductility. Presented in this thesis is a research project conducted by the BEST center at the University of Maryland to study link slab application with UHPC and ECC. Two bridge models were generated for finite element analysis. In addition, a field test was prepared. Experiments were carried out to study material properties of ECC and UHPC for a preliminary assessment of link slab performance using these materials. Results found that ECC and UHPC are adequate for link slab for their strength, high tensile ductility and fine cracks development.en_US
dc.identifierhttps://doi.org/10.13016/5vih-gjrl
dc.identifier.urihttp://hdl.handle.net/1903/22012
dc.language.isoenen_US
dc.subject.pqcontrolledCivil engineeringen_US
dc.subject.pquncontrolledBridge Engineeringen_US
dc.subject.pquncontrolledECCen_US
dc.subject.pquncontrolledFinite Element Analysisen_US
dc.subject.pquncontrolledLink Slaben_US
dc.subject.pquncontrolledStructural Engineeringen_US
dc.subject.pquncontrolledUHPCen_US
dc.titlePERFORMANCE OF LINK SLAB USING ECC AND UHPCen_US
dc.typeThesisen_US

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