University of Maryland LibrariesDigital Repository at the University of Maryland
    • Login
    View Item 
    •   DRUM
    • Theses and Dissertations from UMD
    • UMD Theses and Dissertations
    • View Item
    •   DRUM
    • Theses and Dissertations from UMD
    • UMD Theses and Dissertations
    • View Item
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    MESOSCALE MICROSTRUCTURE EVOLUTION, RELIABILITY AND FAILURE ANALYSIS OF HIGH TEMPERATURE TRANSIENT LIQUID PHASE SINTERING JOINTS

    Thumbnail
    View/Open
    Moeini_umd_0117E_18550.pdf (43.18Mb)
    No. of downloads: 32

    Date
    2017
    Author
    Moeini, Seyed Ali
    Advisor
    McCluskey, Patrick
    DRUM DOI
    https://doi.org/10.13016/M2SQ8QK2B
    Metadata
    Show full item record
    Abstract
    The continuous increase in application temperature of power electronic devices, due to the growing power density, miniaturization, and functionality in military and commercial applications, requires new packaging technologies with high temperature and reliability capabilities. Currently, the traditional maximum allowable temperature of power electronics (125°C) is a limiting factor for high temperature applications, such as space exploration, drilling, avionics, and electronic vehicles. Substitution of Silicon devices with wide bandgap (e.g., SiC) devices has extended the maximum allowable temperatures to 475 ̊C. However, this created the need for robust high temperature packaging materials, especially interconnects and attachments. High temperature solders are often too expensive, too brittle, or environmentally toxic to be used, leading to increased study of low temperature joining techniques, such as solid phase sintering and Transient Liquid Phase Sintering (TLPS), for producing high temperature stable attachments. TLPS is an emerging electronic interconnect technology enabling the formation of high temperature robust joints between metallic surfaces at low temperatures by the consumption of a transient, low temperature, liquid phase to form high temperature stable intermetallic compounds (IMCs). The performance and durability of these materials strongly depend on their microstructure, which is determined by their processing. The complicated process of IMC formation through eutectic solidification and the extensive number of parameters affecting the final microstructure make it impractical to experimentally study the effect of each factor. In this work, phase field modeling of the microstructure of TLPS materials fabricated by different processing methods will be conducted. Phase-field modeling (PFM) is a powerful thermodynamic consistent method in mesoscale modeling that simulates the evolution of intermetallic compounds during the solidification process, providing insight into the final microstructure. Application of this method facilitates the optimization of influential processing factors. Efforts will also be conducted to identify failure modes and mechanisms experimentally under dynamic, power and thermal cycling loads as a function of critical microstructural features, facilitating the optimization of joining parameters to obtain higher durability TLPS interconnections. The objective of this dissertation is to provide an insight into the processing of a reliable high temperature TLPS and facilitate their application in power electronic industries.
    URI
    http://hdl.handle.net/1903/20403
    Collections
    • Mechanical Engineering Theses and Dissertations
    • UMD Theses and Dissertations

    DRUM is brought to you by the University of Maryland Libraries
    University of Maryland, College Park, MD 20742-7011 (301)314-1328.
    Please send us your comments.
    Web Accessibility
     

     

    Browse

    All of DRUMCommunities & CollectionsBy Issue DateAuthorsTitlesSubjectsThis CollectionBy Issue DateAuthorsTitlesSubjects

    My Account

    LoginRegister
    Pages
    About DRUMAbout Download Statistics

    DRUM is brought to you by the University of Maryland Libraries
    University of Maryland, College Park, MD 20742-7011 (301)314-1328.
    Please send us your comments.
    Web Accessibility