A Thermal Management Solution for Compact Power Converters

dc.contributor.advisorMcCluskey, Patricken_US
dc.contributor.authorPower, Danielen_US
dc.contributor.departmentMechanical Engineeringen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.date.accessioned2016-09-15T05:32:30Z
dc.date.available2016-09-15T05:32:30Z
dc.date.issued2016en_US
dc.description.abstractRegulated Transformer Rectifier Units contain several power electronic boards to facilitate AC to DC power conversion. As these units become smaller, the number of devices on each board increases while their distance from each other decreases, making active cooling essential to maintaining reliable operation. Although it is widely accepted that liquid is a far superior heat transfer medium to air, the latter is still capable of yielding low device operating temperatures with proper heat sink and airflow design. The purpose of this study is to describe the models and methods used to design and build the thermal management system for one of the power electronic boards in a compact, high power regulated transformer rectifier unit. Maximum device temperature, available pressure drop and manufacturability were assessed when selecting the final design for testing. Once constructed, the thermal management system’s performance was experimentally verified at three different power levels.en_US
dc.identifierhttps://doi.org/10.13016/M2DJ65
dc.identifier.urihttp://hdl.handle.net/1903/18813
dc.language.isoenen_US
dc.subject.pqcontrolledMechanical engineeringen_US
dc.titleA Thermal Management Solution for Compact Power Convertersen_US
dc.typeThesisen_US

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