Characterization of Transient Heating in Power Electronic Devices and its Implications for Die Attached Reliability

Abstract

Military and commercial interest in the use of power electronics for applications

requiring extreme operating conditions and/or placement in extreme environments is

driving research to identify and develop packaging technologies that can withstand

these conditions. Specifically, there is an interest in the development of packaging

technology than can function reliably under transient high power loading conditions.

This thesis addresses the unique packaging considerations required for this type

of application, with a focus on the implications on the durability of the die attach

layer. Simulations of the thermal conditions experienced at the die attach layer for

different power pulse magnitudes and durations are presented. A test apparatus and

experimental test plan for studying the reliability of die attach materials under high

power transient loading is discussed. Studies conducted to validate the test apparatus

and characterize die attach reliability are described along with recommendations for

further investigation of the reliability issues associated with high power, transient

loading conditions.