Characterization of Transient Heating in Power Electronic Devices and its Implications for Die Attached Reliability

Abstract

Military and commercial interest in the use of power electronics for applications requiring extreme operating conditions and/or placement in extreme environments is driving research to identify and develop packaging technologies that can withstand these conditions. Specifically, there is an interest in the development of packaging technology than can function reliably under transient high power loading conditions. This thesis addresses the unique packaging considerations required for this type of application, with a focus on the implications on the durability of the die attach layer. Simulations of the thermal conditions experienced at the die attach layer for different power pulse magnitudes and durations are presented. A test apparatus and experimental test plan for studying the reliability of die attach materials under high power transient loading is discussed. Studies conducted to validate the test apparatus and characterize die attach reliability are described along with recommendations for further investigation of the reliability issues associated with high power, transient loading conditions.