An Innovative Thermal Management Solution for Cooling of Chips with Various Heights and Power Densities

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dc.contributor.advisorOhadi, Michaelen_US
dc.contributor.authorMcMillin, Timothy Walteren_US
dc.contributor.departmentMechanical Engineeringen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.date.accessioned2007-09-28T15:02:18Z
dc.date.available2007-09-28T15:02:18Z
dc.date.issued2007-08-09en_US
dc.description.abstractThe challenges and benefits of using a liquid-cooled cold plate to cool a multi-processor circuit board with complex geometry were explored. Two cold plates were designed, fabricated, and tested experimentally. Thermal interface resistance was experimentally discovered and confirmed with numerical simulations. A circuit board simulator was constructed. This simulator was meant to mimic a multi-processor circuit board with heat sources of different surface areas, heights, and heat dissipations. Results and discussions are presented in this thesis.en_US
dc.format.extent2319327 bytes
dc.format.mimetypeapplication/pdf
dc.identifier.urihttp://hdl.handle.net/1903/7368
dc.language.isoen_US
dc.subject.pqcontrolledEngineering, Mechanicalen_US
dc.subject.pqcontrolledEngineering, Aerospaceen_US
dc.subject.pqcontrolledEngineering, Mechanicalen_US
dc.subject.pquncontrolledheat transferen_US
dc.subject.pquncontrolledliquid cooleden_US
dc.subject.pquncontrolledcold plateen_US
dc.subject.pquncontrolledelectronic coolingen_US
dc.subject.pquncontrolledthermal managementen_US
dc.titleAn Innovative Thermal Management Solution for Cooling of Chips with Various Heights and Power Densitiesen_US
dc.typeThesisen_US

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