An Innovative Thermal Management Solution for Cooling of Chips with Various Heights and Power Densities

Abstract

The challenges and benefits of using a liquid-cooled cold plate to cool a multi-processor circuit board with complex geometry were explored. Two cold plates were designed, fabricated, and tested experimentally. Thermal interface resistance was experimentally discovered and confirmed with numerical simulations. A circuit board simulator was constructed. This simulator was meant to mimic a multi-processor circuit board with heat sources of different surface areas, heights, and heat dissipations. Results and discussions are presented in this thesis.