An Approach for the Thermal Bonding of Micro-Fluidic Devices

dc.contributor.advisorDeVoe, Donen_US
dc.contributor.authorVela, Adamen_US
dc.contributor.departmentISRen_US
dc.date.accessioned2007-05-23T10:11:10Z
dc.date.available2007-05-23T10:11:10Z
dc.date.issued2001en_US
dc.description.abstractWith the advent of polymers micro fabrication methods for micro-fluidic devices, there has developed the need to investigate various forms of sealing such devices for practical applications. This research documents work performed on the thermal bonding of polymer micro-fluidic devices that contain both channels and reservoirs on the same plane.en_US
dc.format.extent218537 bytes
dc.format.mimetypeapplication/pdf
dc.identifier.urihttp://hdl.handle.net/1903/6224
dc.language.isoen_USen_US
dc.relation.ispartofseriesISR; UG 2001-8en_US
dc.subjectNext-Generation Product Realization Systemsen_US
dc.titleAn Approach for the Thermal Bonding of Micro-Fluidic Devicesen_US
dc.typeThesisen_US

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