A DEMONSTRATION OF GLASS BONDING USING PATTERNED NANOCOMPOSITE THERMITES DEPOSITED FROM FLUID

dc.contributor.advisorZachariah, Michaelen_US
dc.contributor.authorRodriguez, Juan Carlosen_US
dc.contributor.departmentMechanical Engineeringen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.date.accessioned2015-07-17T05:36:46Z
dc.date.available2015-07-17T05:36:46Z
dc.date.issued2015en_US
dc.description.abstractCeramics and other nonmetals are widely used in industrial and research applications. Although these materials provide many advantages, they often pose unique challenges during bonding. This work aims to expand on current processes, which have much narrower applications, to find a more universal method for nonmetal bonding. We utilize inks comprised of aluminum-based nanoenergetics (a heat source) and tin (a bonding agent). Requirements for successful bonding are explored and four key criteria are established. Through statistical simulation and thermochemical equilibrium calculations, we conclude that the presence of a diluent in large percentages negatively impacts reaction kinetics. Conversely, we show small percentages of added tin enhance gas generation and drive faster reaction rates. The bulk bonding material, thermite plus tin, forms a continuous structure during reaction, adhering well to the substrate surface. In some cases, these bonds failed above 1200 kPa.en_US
dc.identifierhttps://doi.org/10.13016/M20W6W
dc.identifier.urihttp://hdl.handle.net/1903/16808
dc.language.isoenen_US
dc.subject.pqcontrolledMechanical engineeringen_US
dc.subject.pqcontrolledMaterials Scienceen_US
dc.subject.pquncontrolledBondingen_US
dc.subject.pquncontrolledDirect Writeen_US
dc.subject.pquncontrolledGlassen_US
dc.subject.pquncontrolledNanoaluminumen_US
dc.subject.pquncontrolledNanothermiteen_US
dc.subject.pquncontrolledTungsten Oxideen_US
dc.titleA DEMONSTRATION OF GLASS BONDING USING PATTERNED NANOCOMPOSITE THERMITES DEPOSITED FROM FLUIDen_US
dc.typeThesisen_US

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