FULL WAFER MAP RESPONSE SURFACE MODELS FOR COMBINATORIAL CHEMICAL VAPOR DEPOSITION REACTOR OPERATIONS

dc.contributor.advisorAdomaitis, Raymond Aen_US
dc.contributor.authorLeon, Maria del Pilaren_US
dc.contributor.departmentChemical Engineeringen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.date.accessioned2008-08-07T05:30:40Z
dc.date.available2008-08-07T05:30:40Z
dc.date.issued2008-05-02en_US
dc.description.abstractA computational toolbox was developed to perform full wafer response surface modeling of combinatorial chemical vapor deposition wafers. It consists of a library of MATLAB object-oriented functions that are based on accurate quadrature methods. The toolbox was tested using three sets of artificially generated wafers. Once the validity of the toolbox was demonstrated, it was used to model tungsten deposition with a Spatially Programmable CVD reactor. As a result, a model of the form T = b1(sqh2s1) + b2(sqh2s2) + b3(sqh2s3) + b14(sqh2s1)(gap) + b24(sqh2s2)(gap) + b34(sqh2s3)(gap) was considered the most appropriate fit to the data. This model takes into account the systems kinetics (it uses the square root of the hydrogen flow), the gas flows into each one of the reactor segments and the inter-segment gas diffusivity.en_US
dc.format.extent3249687 bytes
dc.format.mimetypeapplication/pdf
dc.identifier.urihttp://hdl.handle.net/1903/8313
dc.language.isoen_US
dc.subject.pqcontrolledEngineering, Chemicalen_US
dc.titleFULL WAFER MAP RESPONSE SURFACE MODELS FOR COMBINATORIAL CHEMICAL VAPOR DEPOSITION REACTOR OPERATIONSen_US
dc.typeThesisen_US

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