Show simple item record

Investigation of Reactively Structured Al/Ni Multilayer Foils and their Applications in High Temperature Die Attach

dc.contributor.advisorMcCluskey, Patricken_US
dc.contributor.authorMcClure, Adamen_US
dc.description.abstractThis work focuses on using a reactive layered Al/Ni foil as a localized heat source for electronic die attachment purposes. A two pronged approach was used to demonstrate the viability of this material for attaching die to substrates using AuSn braze. Both experimental sample creation and transient thermal modeling were conducted. This thesis will report thermal simulation and experimental results as well as discussing the joining process and the results of shear strength and thermal cycling reliability testing. A new pre-heating method was developed after results revealed that the initial temperature of the system is vital in predicting how successful a joint will be. Thermal cycling results have shown that die cracking is a significant reliability issue but with further study this reactive joining process shows promise.en_US
dc.format.extent1419515 bytes
dc.titleInvestigation of Reactively Structured Al/Ni Multilayer Foils and their Applications in High Temperature Die Attachen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.contributor.departmentMaterial Science and Engineeringen_US
dc.subject.pqcontrolledEngineering, Materials Scienceen_US
dc.subject.pquncontrolledhigh temperatureen_US
dc.subject.pquncontrolleddie attachen_US
dc.subject.pquncontrolledreactive joiningen_US

Files in this item


This item appears in the following Collection(s)

Show simple item record