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    Investigation of Reactively Structured Al/Ni Multilayer Foils and their Applications in High Temperature Die Attach

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    Date
    2008-11-25
    Author
    McClure, Adam
    Advisor
    McCluskey, Patrick
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    Abstract
    This work focuses on using a reactive layered Al/Ni foil as a localized heat source for electronic die attachment purposes. A two pronged approach was used to demonstrate the viability of this material for attaching die to substrates using AuSn braze. Both experimental sample creation and transient thermal modeling were conducted. This thesis will report thermal simulation and experimental results as well as discussing the joining process and the results of shear strength and thermal cycling reliability testing. A new pre-heating method was developed after results revealed that the initial temperature of the system is vital in predicting how successful a joint will be. Thermal cycling results have shown that die cracking is a significant reliability issue but with further study this reactive joining process shows promise.
    URI
    http://hdl.handle.net/1903/8909
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    • Materials Science & Engineering Theses and Dissertations
    • UMD Theses and Dissertations

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    DRUM is brought to you by the University of Maryland Libraries
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