Thermal Reliability Management in PCB Design.
Thermal Reliability Management in PCB Design.
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Date
1986
Authors
Pecht, Michael
Palmer, Milton, III
Naft, Joseph
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Abstract
This paper investigates the extent to which the thermal reliability of components as a function of their location on a convectively cooled printed circuit board (PCB) needs to be considered in the design process. A technique is then presented so that a near optimal solution can be efficiently obtained.