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    Thermal Reliability Management in PCB Design.

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    TR_86-52.pdf (361.0Kb)
    No. of downloads: 948

    Date
    1986
    Author
    Pecht, Michael
    Palmer, Milton, III
    Naft, Joseph
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    Abstract
    This paper investigates the extent to which the thermal reliability of components as a function of their location on a convectively cooled printed circuit board (PCB) needs to be considered in the design process. A technique is then presented so that a near optimal solution can be efficiently obtained.
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    http://hdl.handle.net/1903/4477
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    DRUM is brought to you by the University of Maryland Libraries
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