Thermal Reliability Management in PCB Design.
| dc.contributor.author | Pecht, Michael | en_US |
| dc.contributor.author | Palmer, Milton, III | en_US |
| dc.contributor.author | Naft, Joseph | en_US |
| dc.contributor.department | ISR | en_US |
| dc.date.accessioned | 2007-05-23T09:35:38Z | |
| dc.date.available | 2007-05-23T09:35:38Z | |
| dc.date.issued | 1986 | en_US |
| dc.description.abstract | This paper investigates the extent to which the thermal reliability of components as a function of their location on a convectively cooled printed circuit board (PCB) needs to be considered in the design process. A technique is then presented so that a near optimal solution can be efficiently obtained. | en_US |
| dc.format.extent | 369694 bytes | |
| dc.format.mimetype | application/pdf | |
| dc.identifier.uri | http://hdl.handle.net/1903/4477 | |
| dc.language.iso | en_US | en_US |
| dc.relation.ispartofseries | ISR; TR 1986-52 | en_US |
| dc.title | Thermal Reliability Management in PCB Design. | en_US |
| dc.type | Technical Report | en_US |
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