Thermal Reliability Management in PCB Design.

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dc.contributor.authorPecht, Michaelen_US
dc.contributor.authorPalmer, Milton, IIIen_US
dc.contributor.authorNaft, Josephen_US
dc.contributor.departmentISRen_US
dc.date.accessioned2007-05-23T09:35:38Z
dc.date.available2007-05-23T09:35:38Z
dc.date.issued1986en_US
dc.description.abstractThis paper investigates the extent to which the thermal reliability of components as a function of their location on a convectively cooled printed circuit board (PCB) needs to be considered in the design process. A technique is then presented so that a near optimal solution can be efficiently obtained.en_US
dc.format.extent369694 bytes
dc.format.mimetypeapplication/pdf
dc.identifier.urihttp://hdl.handle.net/1903/4477
dc.language.isoen_USen_US
dc.relation.ispartofseriesISR; TR 1986-52en_US
dc.titleThermal Reliability Management in PCB Design.en_US
dc.typeTechnical Reporten_US

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