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    Vertically integrated modules for low power embedded sensor systems

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    umi-umd-3817.pdf (2.899Mb)
    No. of downloads: 5845

    Date
    2006-08-30
    Author
    Bles, Christopher
    Advisor
    Goldsman, Neil
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    Abstract
    A typical embedded sensor system consists of an environmental sensor, data storage, and a control circuit (such as a microcontroller). Two main traits desired of these embedded sensor systems are small form factor and low power consumption. However, due to the diverse nature of the design and applications, monolithic solutions incorporating the three main components are often not available on a large cost effective scale. This work describes a method of integrating heterogeneous circuit components into a single module. When combined with efficient operating algorithms the system size is reduced and lifetime is extended. Production or custom designed component chips are thinned and stacked vertically while interconnects are fabricated within the module providing a 3-D integration (3DI) of the system. A Global Positioning System (GPS) location recording sensor system is designed with the intention of applying the 3DI process to reduce its size and power consumption.
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    http://hdl.handle.net/1903/3945
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    • Electrical & Computer Engineering Theses and Dissertations
    • UMD Theses and Dissertations

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    DRUM is brought to you by the University of Maryland Libraries
    University of Maryland, College Park, MD 20742-7011 (301)314-1328.
    Please send us your comments.
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