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Effects of Solder-Dipping as a Termination Re-Finishing Technique

dc.contributor.advisorPecht, Michael G.en_US
dc.contributor.authorSengupta, Shirshoen_US
dc.date.accessioned2006-09-12T06:04:24Z
dc.date.available2006-09-12T06:04:24Z
dc.date.issued2006-08-14en_US
dc.identifier.urihttp://hdl.handle.net/1903/3917
dc.description.abstractSolder-dipping may be used to replace tin-rich finishes with eutectic tin-lead for tin-whiskering risk mitigation purposes. However, re-finishing also subjects electronic parts to new risks, including damage from the thermal re-finishing profile, finish non-uniformity, incomplete replacement of the pre-existing finish and poor solderability from re-finishing. This study overviews solder-dipping as a re-finishing technique and identifies key process and part parameters that could result in risks. A physical analysis procedure was developed and implemented to assess these risks on electronic parts. A quantitative metric was established to assess propensity for thermo-mechanical damage for solder-dipping parts. Surface mount dipped parts were prone to exposure of base-metal or interfacial intermetallics at termination corners, knees and heels. Solder-dipped insertion-mount parts showed regions of low finish thickness and possible deviations from eutectic tin-lead composition at portions close to the part-body.en_US
dc.format.extent3106220 bytes
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.titleEffects of Solder-Dipping as a Termination Re-Finishing Techniqueen_US
dc.typeThesisen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.contributor.departmentMechanical Engineeringen_US
dc.subject.pqcontrolledEngineering, Mechanicalen_US
dc.subject.pqcontrolledEngineering, Packagingen_US
dc.subject.pquncontrolledsolderen_US
dc.subject.pquncontrolleddipen_US
dc.subject.pquncontrolledwhiskeren_US
dc.subject.pquncontrolledthermo-mechanicalen_US
dc.subject.pquncontrolledfinishen_US
dc.subject.pquncontrolledsolderabilityen_US


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