Mechanical Engineering

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    Damage Assessment Using Information Entropy of Individual Acoustic Emission Waveforms during Cyclic Fatigue Loading
    (MDPI, 2017-05-30) Sauerbrunn, Christine M.; Kahirdeh, Ali; Yun, Huisung; Modarres, Mohammad
    Information entropy measured from acoustic emission (AE) waveforms is shown to be an indicator of fatigue damage in a high-strength aluminum alloy. Three methods of measuring the AE information entropy, regarded as a direct measure of microstructural disorder, are proposed and compared with traditional damage-related AE features. Several tension–tension fatigue experiments were performed with dogbone samples of aluminum 7075-T6, a commonly used material in aerospace structures. Unlike previous studies in which fatigue damage is measured based on visible crack growth, this work investigated fatigue damage both prior to and after crack initiation through the use of instantaneous elastic modulus degradation. Results show that one of the three entropy measurement methods appears to better assess the damage than the traditional AE features, whereas the other two entropies have unique trends that can differentiate between small and large cracks.
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    Measures of Entropy to Characterize Fatigue Damage in Metallic Materials
    (MDPI, 2019-08-17) Yu, Huisung; Modarres, Mohammad
    This paper presents the entropic damage indicators for metallic material fatigue processes obtained from three associated energy dissipation sources. Since its inception, reliability engineering has employed statistical and probabilistic models to assess the reliability and integrity of components and systems. To supplement the traditional techniques, an empirically-based approach, called physics of failure (PoF), has recently become popular. The prerequisite for a PoF analysis is an understanding of the mechanics of the failure process. Entropy, the measure of disorder and uncertainty, introduced from the second law of thermodynamics, has emerged as a fundamental and promising metric to characterize all mechanistic degradation phenomena and their interactions. Entropy has already been used as a fundamental and scale-independent metric to predict damage and failure. In this paper, three entropic-based metrics are examined and demonstrated for application to fatigue damage. We collected experimental data on energy dissipations associated with fatigue damage, in the forms of mechanical, thermal, and acoustic emission (AE) energies, and estimated and correlated the corresponding entropy generations with the observed fatigue damages in metallic materials. Three entropic theorems—thermodynamics, information, and statistical mechanics—support approaches used to estimate the entropic-based fatigue damage. Classical thermodynamic entropy provided a reasonably constant level of entropic endurance to fatigue failure. Jeffreys divergence in statistical mechanics and AE information entropy also correlated well with fatigue damage. Finally, an extension of the relationship between thermodynamic entropy and Jeffreys divergence from molecular-scale to macro-scale applications in fatigue failure resulted in an empirically-based pseudo-Boltzmann constant equivalent to the Boltzmann constant.
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    DEVELOPMENT OF AN OFF-LINE RAINFLOW COUNTING ALGORITHM WITH TEMPORAL PARAMETERS AND DATA REDUCTION
    (2016) Twomey, James Matthew; Pecht, Michael G; Mechanical Engineering; Digital Repository at the University of Maryland; University of Maryland (College Park, Md.)
    Rainflow counting methods convert a complex load time history into a set of load reversals for use in fatigue damage modeling. Rainflow counting methods were originally developed to assess fatigue damage associated with mechanical cycling where creep of the material under load was not considered to be a significant contributor to failure. However, creep is a significant factor in some cyclic loading cases such as solder interconnects under temperature cycling. In this case, fatigue life models require the dwell time to account for stress relaxation and creep. This study develops a new version of the multi-parameter rainflow counting algorithm that provides a range-based dwell time estimation for use with time-dependent fatigue damage models. To show the applicability, the method is used to calculate the life of solder joints under a complex thermal cycling regime and is verified by experimental testing. An additional algorithm is developed in this study to provide data reduction in the results of the rainflow counting. This algorithm uses a damage model and a statistical test to determine which of the resultant cycles are statistically insignificant to a given confidence level. This makes the resulting data file to be smaller, and for a simplified load history to be reconstructed.
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    EVOLUTION OF THE MICROSTRUCTURE AND VISCOPLASTIC BEHAVIOR OF MICROSCALE SAC305 SOLDER JOINTS AS A FUNCTION OF MECHANICAL FATIGUE DAMAGE
    (2009) Cuddalorepatta, Gayatri; Dasgupta, Abhijit; Mechanical Engineering; Digital Repository at the University of Maryland; University of Maryland (College Park, Md.)
    The effect of mechanical cycling fatigue damage and isothermal aging histories on the evolution of the constitutive and fatigue responses, and microstructure of microscale SAC305 solder joints is investigated. In particular, the study examines if joint dependent behavior should be expected from as-fabricated and cycled microscale SAC305 joints that exhibit an initial non-homogenous coarse-grained Sn microstructure. In addition, the ability of traditionally used macroscale constitutive models based on continuum mechanics to represent the viscoplastic constitutive behavior of the non-homogenous as-fabricated microscale SAC305 specimens is explored. Insights into the effect of key microstructural features and dominant creep mechanisms influencing the measured viscoplastic behavior of SAC305 are provided using a multi-scale mechanistic modeling framework. Modified lap-shear microscale SAC305 specimens are characterized using the thermomechanical microscale test setup (TMM). Microscale SAC305 solder specimens show significant piece-to-piece variability in the viscoplastic constitutive properties under identical loading histories in the as-fabricated state. The mechanical response is strongly influenced by the grain microstructure across the entire joint, which is non-repeatable and comprises of very few highly anisotropic Sn grains. The statistical non-homogeneity in the microstructure and the associated variability in the mechanical properties in the microscale SAC305 test specimen are far more significant than in similar Sn37Pb specimens, and are consistent with those reported for functional microelectronics solder interconnects. In spite of the scatter, as-fabricated SAC305 specimens exhibit superior creep-resistance (and lower stress relaxation) than Sn37Pb. Macroscale creep model constants represent the non-homogeneous behavior of microscale joints in an average sense. Macroscale modeling results show that the range of scatter measured from macroscale creep model constants is within the range of scatter obtained from the stress relaxation predictions. Stress relaxation predictions are strongly sensitive to the inclusion or exclusion of primary creep models. The proposed multiscale framework effectively captures the dominant creep deformation mechanisms and the influence of key microstructural features on the measured secondary creep response of microscale as-fabricated SAC305 solder specimens. The multiscale model predictions for the effect of alloy composition on SAC solders provide good agreement with test measurements. The multiscale model can be extended to understand the effects of other parameters such as aging and manufacturing profiles, thereby aiding in the effective design and optimization of the viscoplastic behavior of SAC alloys. Accumulated fatigue damage and isothermal aging are found to degrade the constitutive and mechanical fatigue properties of the solder. The scatter gradually decreases with an increasing state of solder damage. Compared to the elastic-plastic and creep measurements, the variability in the fatigue life of these non-homogenous solder joints under mechanical fatigue tests is negligible. Recrystallization is evident under creep and mechanical fatigue loads. Gradual homogenization of the Sn grain microstructure with damage is a possible reason for the observed evolution of scatter in the isothermal mechanical fatigue curves. The yield stress measurements suggest that SAC305 obeys a hardening rule different from that of isotropic or kinematic hardening. The measured degradation in elastic, plastic and yield properties is captured reasonably well with a continuum damage mechanics model from the literature.