UMD Theses and Dissertations

Permanent URI for this collectionhttp://hdl.handle.net/1903/3

New submissions to the thesis/dissertation collections are added automatically as they are received from the Graduate School. Currently, the Graduate School deposits all theses and dissertations from a given semester after the official graduation date. This means that there may be up to a 4 month delay in the appearance of a given thesis/dissertation in DRUM.

More information is available at Theses and Dissertations at University of Maryland Libraries.

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Author: search.filters.author.Srinivas, VikramSubject: search.filters.subject.Damage modeling

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    MODELING RATE DEPENDENT DURABILITY OF LOW-Ag SAC INTERCONNECTS FOR AREA ARRAY PACKAGES UNDER TORSION LOADS
    (2010) Srinivas, Vikram; Pecht, Michael G.; Mechanical Engineering; Digital Repository at the University of Maryland; University of Maryland (College Park, Md.)
    The thesis discusses modeling rate-dependent durability of solder interconnects under mechanical torsion loading for surface mount area array components. The study discusses an approach to incorporate strain-rate dependency in durability estimation for solder interconnects. The components under study are two configurations of BGAs (ball grid array) assembled with select lead-free solders. A torsion test setup is used to apply displacement controlled loads on the test board. Accelerated test load profile is experimentally determined. Torsion test is carried out for all the components under investigation to failure. Strain-rate dependent (Johnson-Cook model) and strain-rate independent, elastic-plastic properties are used to model the solders in finite element simulation. Damage model from literature is used to estimate the durability for SAC305 solder to validate the approach. Test data is used to extract damage model constants for SAC105 solder and extract mechanical fatigue durability curve.