MULTILAYER ELECTRONIC STRUCTURES PRODUCED BY ADDITIVE CODEPOSITION OF METAL AND CERAMIC

Abstract

Conventional manufacturing processes for electronics are wasteful and expensive. Co-depositionadditive manufacturing offers a promising approach for fabricating high-temperature electronic circuits by integrating ceramic and metallic materials. This study focuses on the dual deposition of alumina (Al₂O₃) and silver-tin-molybdenum (Ag-Sn-Mo) transient liquid phase sintering (TLPS) paste to create functional structures for electronic applications. This process of co- deposition combines conductive and insulating materials in one process resulting in an expedited operation, with significantly reduced waste compared to regular manufacturing. Direct ink writing has received attention for metallizing electronic substrates because the printing can be performed on low-cost equipment. The biggest challenge in direct ink writing is in the ink itself. Printing on electronic substrates typically requires pressure less sintering, and many available inks and pastes produce porous structures when sintered without pressure. Additionally, the elevated temperature results in challenges such as thermal expansion mismatch, cracking, and shrinkage during the sintering process. These issues are exacerbated by the temperature needed for processing the alumina paste. This research investigates the material compatibility, deposition techniques, and processing parameters to optimize the co-deposition of these materials. Additionally, it evaluates the impact of the sintering profile, and the paste formulation of the TLPS on the mechanical integrity and interfacial adhesion of the layers.