DROP DURABILITY ASSESSMENT OF ELECTRONIC ASSEMBLIES UNDER OFF-AXIS LOADING WITH SKEWED FIXTURES

Abstract

This thesis studies drop durability of electronic assemblies when the acceleration vector is oriented at 45° to the out-of-plane direction of the circuit card. The off-axis drop tests are accomplished with a skewed fixture and are conducted as a proxy for multiaxial drop testing. Advanced shock testing and vibration test methods have been developed over the last few decades to better represent real-world field environments during ground-based laboratory testing. However, many of these test methods require expensive and specialized equipment not available in most laboratories. An alternative approach for approximating simultaneous loading along multiple axes on conventional equipment utilizes skewed fixtures which have seen use in off-axis random vibration and drop impact testing. These methods generally rely on the conversion of a uniaxial input load from the test equipment (using a uniaxial drop tower or shaker) into a multiaxial load when resolved in the reference frame of the test article (mounted on a skewed fixture).Skewed fixture design is presented and recommendations for conducting skewed angle drop testing are introduced based on local measurements along the skewed face of the fixture to accurately monitor the impact event. Characterization tests were performed with a skewed fixture, at simultaneous acceleration loads from 500 to 3,000 g in two (in-plane and out-of-plane) directions, while meeting standard time domain tolerances. Upon experimental characterization, drop shock durability tests were conducted on a printed circuit assembly (PCA). Mean drops-to-failure were measured and quantified with Weibull statistics. Dominant solder joint failure modes were identified via failure analysis. Prior work on inclined angle impact testing is limited, and the majority of solder joint interconnect level fatigue studies are conducted considering perpendicular loading normal the circuit card. Low-cycle fatigue curves are generated based on plastic strain and plastic work density within the solder joint. A multiscale nonlinear finite element model is used to relate board-level flexure to solder joint interconnect level plastic strain. A high strain rate solder constitutive model allows for accurate modeling of solder plasticity resulting from high-impact drop shock. Fatigue parameters are computed from the Coffin-Manson relation and Palmgren-Miner damage accumulation. This work serves to apply established low-cycle fatigue methods for conventional drop shock loading (impact normal to circuit card) to non-perpendicular loading with a skewed fixture.