A Self-Contained Cold Plate Utilizing Force-Fed Evaporation for Cooling of High-Flux Electronics

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dc.contributor.advisorOhadi, Michael Men_US
dc.contributor.authorBaummer, Thomas Buchananen_US
dc.contributor.departmentMechanical Engineeringen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.date.accessioned2008-04-22T16:08:31Z
dc.date.available2008-04-22T16:08:31Z
dc.date.issued2007-12-11en_US
dc.descriptionNOTE: If you have problems opening the file, save the document to your computer and then try opening it.
dc.description.abstractIn recent years, the rapid increase in the functionality, speed, and power density of electronics has introduced new challenges, which have led to demand for high heat flux electronics cooling at levels that cannot be met by conventional technologies. The next generation of high power electronics will require advanced cooling beyond the methodologies currently available. This thesis describes work done on a novel form of two-phase heat transfer, named "Force-Fed Evaporation," which addresses this need. This process utilizes evaporation of a liquid in a microchannel surface to produce high heat transfer coefficient cooling at very high heat flux while maintaining a low hydraulic pressure drop. Component level tests were conducted to demonstrate the capability of this process. This led to the development of a self-contained, two-phase cold plate suitable for cooling a high power circuit board. The results show that this technology bears promise for the future of electronics cooling.en_US
dc.format.extent44894105 bytes
dc.format.mimetypeapplication/pdf
dc.identifier.urihttp://hdl.handle.net/1903/7795
dc.language.isoen_US
dc.subject.pqcontrolledEngineering, Mechanicalen_US
dc.subject.pquncontrolledelectronics coolingen_US
dc.subject.pquncontrolledevaporationen_US
dc.subject.pquncontrolledboilingen_US
dc.subject.pquncontrolledtwo-phaseen_US
dc.subject.pquncontrolledheat transferen_US
dc.subject.pquncontrolledfluiden_US
dc.titleA Self-Contained Cold Plate Utilizing Force-Fed Evaporation for Cooling of High-Flux Electronicsen_US
dc.typeThesisen_US

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