A Computer Aided Engineering Program for Coplanar and In-Line Printed Wiring Board Thermal and Thermal Reliability Analysis.
| dc.contributor.author | Pecht, M. | en_US |
| dc.contributor.author | Palmer, M. | en_US |
| dc.contributor.department | ISR | en_US |
| dc.date.accessioned | 2007-05-23T09:34:20Z | |
| dc.date.available | 2007-05-23T09:34:20Z | |
| dc.date.issued | 1985 | en_US |
| dc.description.abstract | This report is a review of the cooperative: Westinghouse University of Maryland, Mechanical Engineering, computer-aided design (CAD) of a printed wiring board (PWB) project. In earlier cooperation (1984) with Westinghouse, an interface link was developed between the computer-aided PWB layout and routing routine (RECAL-REDAC) and a thermal analysis routine. A CAD program, called MTEMP resulted, which performs a thermal analysis for in-line PWB's without the requirements of "hand" scaling and node shifting used by previous programs, eliminates much of the I/O by providing a direct link with REDAC, and provides an accurate graphical model of the PWB. Finally, to control development cost and conform to copyrights, MTEMP does not alter REDAC. Our research effort over the 1985 year consisted of developing a coplanar thermal analysis program , a thermal reliability analysis program which was integrated into a user friendly printed wiring board design program. In addition heat dissipation input for each component can now be manually entered or can be accessed from the working database. A component database shell was developed that will aid in the thermal , reliability analysis , can be called from any routine as needed. This solves one of the past limitations in that there was no reference from the PWB components to the actual part numbers. | en_US |
| dc.format.extent | 373491 bytes | |
| dc.format.mimetype | application/pdf | |
| dc.identifier.uri | http://hdl.handle.net/1903/4404 | |
| dc.language.iso | en_US | en_US |
| dc.relation.ispartofseries | ISR; TR 1985-31 | en_US |
| dc.title | A Computer Aided Engineering Program for Coplanar and In-Line Printed Wiring Board Thermal and Thermal Reliability Analysis. | en_US |
| dc.type | Technical Report | en_US |
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