Measurements of True Leak Rates of MEMS Packages

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dc.contributor.authorHan, Bongtae
dc.date.accessioned2024-01-30T18:57:35Z
dc.date.available2024-01-30T18:57:35Z
dc.date.issued2012-03-06
dc.description.abstractGas transport mechanisms that characterize the hermetic behavior of MEMS packages are fundamentally different depending upon which sealing materials are used in the packages. In metallic seals, gas transport occurs through a few nanoscale leak channels (gas conduction) that are produced randomly during the solder reflow process, while gas transport in polymeric seals occurs through the bulk material (gas diffusion). In this review article, the techniques to measure true leak rates of MEMS packages with the two sealing materials are described and discussed: a Helium mass spectrometer based technique for metallic sealing and a gas diffusion based model for polymeric sealing.
dc.description.urihttps://doi.org/10.3390/s120303082
dc.identifierhttps://doi.org/10.13016/dspace/ila7-ps9r
dc.identifier.citationHan, B. Measurements of True Leak Rates of MEMS Packages. Sensors 2012, 12, 3082-3104.
dc.identifier.urihttp://hdl.handle.net/1903/31624
dc.language.isoen_US
dc.publisherMDPI
dc.relation.isAvailableAtA. James Clark School of Engineeringen_us
dc.relation.isAvailableAtMechanical Engineeringen_us
dc.relation.isAvailableAtDigital Repository at the University of Marylanden_us
dc.relation.isAvailableAtUniversity of Maryland (College Park, MD)en_us
dc.subjectMEMS package
dc.subjecthermeticity
dc.subjecthelium mass spectrometer
dc.subjecttrue leak rate
dc.subjectgas conduction
dc.subjectgas diffusion
dc.subjectmetallic seals
dc.subjectpolymeric seals
dc.titleMeasurements of True Leak Rates of MEMS Packages
dc.typeArticle
local.equitableAccessSubmissionNo

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