Measurements of True Leak Rates of MEMS Packages
| dc.contributor.author | Han, Bongtae | |
| dc.date.accessioned | 2024-01-30T18:57:35Z | |
| dc.date.available | 2024-01-30T18:57:35Z | |
| dc.date.issued | 2012-03-06 | |
| dc.description.abstract | Gas transport mechanisms that characterize the hermetic behavior of MEMS packages are fundamentally different depending upon which sealing materials are used in the packages. In metallic seals, gas transport occurs through a few nanoscale leak channels (gas conduction) that are produced randomly during the solder reflow process, while gas transport in polymeric seals occurs through the bulk material (gas diffusion). In this review article, the techniques to measure true leak rates of MEMS packages with the two sealing materials are described and discussed: a Helium mass spectrometer based technique for metallic sealing and a gas diffusion based model for polymeric sealing. | |
| dc.description.uri | https://doi.org/10.3390/s120303082 | |
| dc.identifier | https://doi.org/10.13016/dspace/ila7-ps9r | |
| dc.identifier.citation | Han, B. Measurements of True Leak Rates of MEMS Packages. Sensors 2012, 12, 3082-3104. | |
| dc.identifier.uri | http://hdl.handle.net/1903/31624 | |
| dc.language.iso | en_US | |
| dc.publisher | MDPI | |
| dc.relation.isAvailableAt | A. James Clark School of Engineering | en_us |
| dc.relation.isAvailableAt | Mechanical Engineering | en_us |
| dc.relation.isAvailableAt | Digital Repository at the University of Maryland | en_us |
| dc.relation.isAvailableAt | University of Maryland (College Park, MD) | en_us |
| dc.subject | MEMS package | |
| dc.subject | hermeticity | |
| dc.subject | helium mass spectrometer | |
| dc.subject | true leak rate | |
| dc.subject | gas conduction | |
| dc.subject | gas diffusion | |
| dc.subject | metallic seals | |
| dc.subject | polymeric seals | |
| dc.title | Measurements of True Leak Rates of MEMS Packages | |
| dc.type | Article | |
| local.equitableAccessSubmission | No |