RELIABILITY OF LEAD-FREE HIGH TEMPERATURE SURFACE MOUNT COMPONENT ATTACHES

dc.contributor.advisorMcCluskey, F. P.en_US
dc.contributor.authorOberc, Timothy Jamesen_US
dc.contributor.departmentMechanical Engineeringen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.date.accessioned2009-03-24T05:37:26Z
dc.date.available2009-03-24T05:37:26Z
dc.date.issued2008en_US
dc.description.abstractThis work investigates the relative reliabilities of SAC305, eutectic Au-Sn, and Ag-In transient liquid phase sintered (TLPS) solder joints subjected to high temperature passive thermal cycling. These solder materials were monitored for electrical resistance, mechanical pull strength, and microstructural changes during cycling. In fabricating the test assemblies, SAC305 and eutectic Au-Sn manufacturing parameters were gathered from the paste distributors while fabrication with Ag-In TLPS required in-house development. Work with the Ag-In TLPS paste revealed that reducing the additive (In) particle size led to statistically significant improvements in the solid volume fraction of the joints. Successful attachment of ceramic quadflat packs (CQFPs) to polyimide circuit boards using Ag-In TLPS demonstrated that surface mount joints with mechanical and electrical integrity could be manufactured from the material. Au-Sn was found to be the strongest of the materials while cracking in the SAC305 and Ag-In samples during cycling resulted in weaker joints.en_US
dc.format.extent10171695 bytes
dc.format.mimetypeapplication/pdf
dc.identifier.urihttp://hdl.handle.net/1903/8987
dc.language.isoen_US
dc.subject.pqcontrolledEngineering, Mechanicalen_US
dc.subject.pqcontrolledEngineering, Metallurgyen_US
dc.subject.pqcontrolledEngineering, Electronics and Electricalen_US
dc.subject.pquncontrolledHigh Temperatureen_US
dc.subject.pquncontrolledPassive Thermal Cyclingen_US
dc.subject.pquncontrolledReliabilityen_US
dc.subject.pquncontrolledSolder Pasteen_US
dc.subject.pquncontrolledSurface Mounten_US
dc.subject.pquncontrolledTransient Liquid Phase Sinteringen_US
dc.titleRELIABILITY OF LEAD-FREE HIGH TEMPERATURE SURFACE MOUNT COMPONENT ATTACHESen_US
dc.typeThesisen_US

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