A Cost Model for Assessing the Transition to Lead-Free Electronics

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dc.contributor.advisorSandborn, Peteren_US
dc.contributor.authorJafreen, Rifaten_US
dc.contributor.departmentMechanical Engineeringen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.date.accessioned2008-08-07T05:30:38Z
dc.date.available2008-08-07T05:30:38Z
dc.date.issued2008-05-01en_US
dc.description.abstractActions such as the WEEE Directive and RoHS Directive are forcing electronics suppliers to transition their products from tin-lead to lead-free solder in order to support consumer goods. The defense and avionics industries obtain their parts from the same suppliers and must adapt to these new lead-free products. In this thesis, a cost model was created to evaluate the transition from lead-free to tin-lead electronics. The model provides the industry with multiple transition options and determines the costs associated with each of these options. The options modeled are an all tin-lead assembly, a lead-free assembly and a mixed assembly. The cost model assimilates all the costs involved in the transition to lead-free and includes changes in reliability, and plan development and maintenance costs. The model requires users to input information specific to their organization. The model also predicts costs incurred when more than one plan, i.e., a specific set of materials and qualifications, must be supported.en_US
dc.format.extent895729 bytes
dc.format.mimetypeapplication/pdf
dc.identifier.urihttp://hdl.handle.net/1903/8312
dc.language.isoen_US
dc.subject.pqcontrolledEngineering, Mechanicalen_US
dc.subject.pquncontrolledlead-freeen_US
dc.subject.pquncontrolledelectronicsen_US
dc.subject.pquncontrolledcost modelen_US
dc.titleA Cost Model for Assessing the Transition to Lead-Free Electronicsen_US
dc.typeThesisen_US

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