HARMONIC VIBRATION TESTING OF ELECTRONIC COMPONENTS ATTACHED TO PRINTED WIRING BOARDS WITH SAC305 AND EUTECTIC SnPb SOLDER

Simple item page
dc.contributor.advisorBarker, Donald Ben_US
dc.contributor.authorPaquette, Beth Milleren_US
dc.contributor.departmentMechanical Engineeringen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.date.accessioned2011-02-19T06:38:07Z
dc.date.available2011-02-19T06:38:07Z
dc.date.issued2010en_US
dc.description.abstractBall grid arrays attached to printed wiring boards with conventional tin-lead solder (63/37) and one of the leading lead-free tin-silver-copper solders (SAC305) were tested at high and low load levels of harmonic vibration. Leadless chip resistors attached to printed wiring boards with conventional tin-lead solder and lead-free solders (SAC105 and SAC305, and tin-nickel-copper, SN100C) were tested at low levels of harmonic vibration. The tests were conducted near the natural frequency of the assemblies to accelerate testing and to generate high cycle fatigue failures in a reasonable amount of time. The results showed that there are nearly negligible differences in the high cycle fatigue life between the SnPb and SAC305 solders. SN100C and SAC105 were less durable. A master durability plot was generated for SAC305 and SnPb to confirm the negligible-difference between the solders. A safe area was defined be used as a design goal for survivablity for circuit board design.en_US
dc.identifier.urihttp://hdl.handle.net/1903/11101
dc.subject.pqcontrolledMechanical Engineeringen_US
dc.subject.pquncontrolledball grid arrayen_US
dc.subject.pquncontrolledlead-freeen_US
dc.subject.pquncontrolledresistoren_US
dc.subject.pquncontrolledSAC305en_US
dc.subject.pquncontrolledvibrationen_US
dc.titleHARMONIC VIBRATION TESTING OF ELECTRONIC COMPONENTS ATTACHED TO PRINTED WIRING BOARDS WITH SAC305 AND EUTECTIC SnPb SOLDERen_US
dc.typeThesisen_US

Files

Original bundle
Now showing 1 - 1 of 1
Thumbnail Image
Name:
Paquette_umd_0117N_11653.pdf
Size:
2.41 MB
Format:
Adobe Portable Document Format
Download

Collections

UMD Theses and Dissertations
Mechanical Engineering Theses and Dissertations