ATOMIC LAYER DEPOSITION OF NICKEL THIN FILMS FOR SPACECRAFT OPTICAL APPLICATIONS
dc.contributor.advisor | Adomaitis, Raymond A. | en_US |
dc.contributor.author | Ku, Ching-En | en_US |
dc.contributor.department | Chemical Engineering | en_US |
dc.contributor.publisher | Digital Repository at the University of Maryland | en_US |
dc.contributor.publisher | University of Maryland (College Park, Md.) | en_US |
dc.date.accessioned | 2021-02-13T06:40:11Z | |
dc.date.available | 2021-02-13T06:40:11Z | |
dc.date.issued | 2020 | en_US |
dc.description.abstract | Two approaches for Ni Atomic Layer Deposition on glass substrates have been studied for spacecraft optical applications. The first strategy is to first deposit a NiO thin film and then reduce the metal oxide film using noble gas under high temperature. NiCp2 and O3 as the precursors were chosen due to the low-temperature required for deposition and high growth rate. An alternative pathway was to deposit a Ru metallic film as the adsorption layer, using Ru(DMBD)(CO)3 and H2O, then deposit the Ni metallic film on the Ru film using Ni(DAD)2 and tert-butylamine. The reaction mechanisms for both processes were developed. The ideal theoretical growth rates of these ALD processes were calculated as 2.40 Å/cycle for NiO, 2.19 Å/cycle for Ru and 2.04 Å/cycle for Ni metallic film. | en_US |
dc.identifier | https://doi.org/10.13016/jlec-nfbo | |
dc.identifier.uri | http://hdl.handle.net/1903/26767 | |
dc.language.iso | en | en_US |
dc.subject.pqcontrolled | Chemical engineering | en_US |
dc.subject.pquncontrolled | Atomic layer deposition | en_US |
dc.subject.pquncontrolled | Nickel | en_US |
dc.subject.pquncontrolled | Nickel oxide | en_US |
dc.subject.pquncontrolled | Ruthenium | en_US |
dc.subject.pquncontrolled | thin film | en_US |
dc.title | ATOMIC LAYER DEPOSITION OF NICKEL THIN FILMS FOR SPACECRAFT OPTICAL APPLICATIONS | en_US |
dc.type | Thesis | en_US |
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