ATOMIC LAYER DEPOSITION OF NICKEL THIN FILMS FOR SPACECRAFT OPTICAL APPLICATIONS

dc.contributor.advisorAdomaitis, Raymond A.en_US
dc.contributor.authorKu, Ching-Enen_US
dc.contributor.departmentChemical Engineeringen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.date.accessioned2021-02-13T06:40:11Z
dc.date.available2021-02-13T06:40:11Z
dc.date.issued2020en_US
dc.description.abstractTwo approaches for Ni Atomic Layer Deposition on glass substrates have been studied for spacecraft optical applications. The first strategy is to first deposit a NiO thin film and then reduce the metal oxide film using noble gas under high temperature. NiCp2 and O3 as the precursors were chosen due to the low-temperature required for deposition and high growth rate. An alternative pathway was to deposit a Ru metallic film as the adsorption layer, using Ru(DMBD)(CO)3 and H2O, then deposit the Ni metallic film on the Ru film using Ni(DAD)2 and tert-butylamine. The reaction mechanisms for both processes were developed. The ideal theoretical growth rates of these ALD processes were calculated as 2.40 Å/cycle for NiO, 2.19 Å/cycle for Ru and 2.04 Å/cycle for Ni metallic film.en_US
dc.identifierhttps://doi.org/10.13016/jlec-nfbo
dc.identifier.urihttp://hdl.handle.net/1903/26767
dc.language.isoenen_US
dc.subject.pqcontrolledChemical engineeringen_US
dc.subject.pquncontrolledAtomic layer depositionen_US
dc.subject.pquncontrolledNickelen_US
dc.subject.pquncontrolledNickel oxideen_US
dc.subject.pquncontrolledRutheniumen_US
dc.subject.pquncontrolledthin filmen_US
dc.titleATOMIC LAYER DEPOSITION OF NICKEL THIN FILMS FOR SPACECRAFT OPTICAL APPLICATIONSen_US
dc.typeThesisen_US

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