Polysilicon RTCVD Process Optimization for Environmentally- Conscious Manufacturing

dc.contributor.authorLu, Guangquanen_US
dc.contributor.authorBora, Monalisaen_US
dc.contributor.authorRubloff, Gary W.en_US
dc.contributor.departmentISRen_US
dc.date.accessioned2007-05-23T10:02:16Z
dc.date.available2007-05-23T10:02:16Z
dc.date.issued1996en_US
dc.description.abstractIn the semiconductor manufacturing industry, optimization of advanced equipment and process designs must include both manufacturing metrics (such as cycle time, consumables cost, and product quality) and environmental consequences (such as reactant utilization and by-product emission). We have investigated the optimization of rapid thermal chemical vapor deposition (RTCVD) of polysilicon from SiH4 as a function of process parameters using a physically-based dynamic simulation approach. The simulator captures essential time-dependent behaviors of gas flow, heat transfer, reaction chemistry, and sensor and control systems, and is validated by our experimental data. Significant improvements in SiH4 utilization (up to 7 x) and process cycle time (up to 3 x) can be achieved by changes in (i) timing for initiating wafer heating relative to starting process gas flow; (ii) process temperature (650 - 750oC ) ; and (iii) gas flow rate (100 - 1000 sccm). Enhanced gas utilization efficiency and reduced process cycle time provide benefits for both environmental considerations and manufacturing productivity (throughput). Dynamic simulation proves to be a versatile and powerful technique for identifying optimal process parameters and for assessing tradeoffs between various manufacturing and environmental metrics.en_US
dc.format.extent1059951 bytes
dc.format.mimetypeapplication/pdf
dc.identifier.urihttp://hdl.handle.net/1903/5789
dc.language.isoen_USen_US
dc.relation.ispartofseriesISR; TR 1996-72en_US
dc.subjectoptimizationen_US
dc.subjectsimulationen_US
dc.subjectflexible manufacturingen_US
dc.subjectmanufacturingen_US
dc.subjectIntelligent Control Systemsen_US
dc.titlePolysilicon RTCVD Process Optimization for Environmentally- Conscious Manufacturingen_US
dc.typeTechnical Reporten_US

Files

Original bundle
Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
TR_96-72.pdf
Size:
1.01 MB
Format:
Adobe Portable Document Format