LEAD-FREE ELECTRONICS USE AND REPAIR DYNAMIC SIMULATION

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dc.contributor.advisorSandborn, Peter Aen_US
dc.contributor.authorChaloupka, Andrew Charlesen_US
dc.contributor.departmentMechanical Engineeringen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.date.accessioned2010-02-19T06:55:19Z
dc.date.available2010-02-19T06:55:19Z
dc.date.issued2009en_US
dc.description.abstractThe conversion from tin-lead to lead-free electronics has increased concern amongst engineers about the reliability of electronic assemblies. In order to communicate the impact of the conversion in terms of cost and availability, a simulation of electronic systems at the LRU level to and through a repair facility was created. The model includes the effects of repair prioritization, multiple possible failure mechanisms, no-fault-founds, and un-repairable units. Example analyses were performed on electronic assemblies that use SAC and SnPb solder using a repair process modeled after a NSWC Crane Aviation Repair Process. The case studies revealed that LRUs exposed to usage profiles characteristic of aerospace and high performance applications, high thermal cycling temperatures with short dwell times, SAC exhibited significantly increased repair costs when compared to tin-lead. Prioritizing LRUs and increasing the rate of deployment had no significant impact on the cost or availability metrics for the cases considered.en_US
dc.identifier.urihttp://hdl.handle.net/1903/9932
dc.subject.pqcontrolledEngineering, Mechanicalen_US
dc.subject.pqcontrolledEngineering, Electronics and Electricalen_US
dc.subject.pquncontrolleddiscrete eventen_US
dc.subject.pquncontrolledlead-freeen_US
dc.subject.pquncontrolledmodelen_US
dc.subject.pquncontrolledreliabilityen_US
dc.subject.pquncontrolledrepair simulationen_US
dc.subject.pquncontrolledRoHSen_US
dc.titleLEAD-FREE ELECTRONICS USE AND REPAIR DYNAMIC SIMULATIONen_US
dc.typeThesisen_US

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