TSV-Constrained Micro-Channel Infrastructure Design for Cooling Stacked 3D-ICs

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dc.contributor.authorShi, Bing
dc.contributor.authorSrivastava, Ankur
dc.date.accessioned2011-05-12T14:08:31Z
dc.date.available2011-05-12T14:08:31Z
dc.date.issued2011-05-11
dc.description.abstractMicro-channel based liquid cooling has significant capability of removing high density heat in 3D-ICs. The conventional micro-channel structures investigated for cooling 3D-ICs use straight channels. However, the presence of TSVs which form obstacles to the micro-channels prevents distribution of straight micro-channels. In this paper, we investigate the methodology of designing TSV-constrained micro-channel infrastructure. Specifically, we decide the locations and geometry of micro-channels with bended structure so that it's cooling e®ectiveness is maximized. Our micro-channel structure could achieve up to 87% pumping power saving compared with the micro-channel structure using straight channels.en_US
dc.identifier.urihttp://hdl.handle.net/1903/11392
dc.language.isoen_USen_US
dc.relation.isAvailableAtInstitute for Systems Researchen_us
dc.relation.isAvailableAtDigital Repository at the University of Marylanden_us
dc.relation.isAvailableAtUniversity of Maryland (College Park, MD)en_us
dc.relation.ispartofseriesTR_2011-03
dc.subject3D-ICen_US
dc.subjectMicro-channelen_US
dc.subjectLiquid coolingen_US
dc.titleTSV-Constrained Micro-Channel Infrastructure Design for Cooling Stacked 3D-ICsen_US
dc.typeTechnical Reporten_US

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