Validation of a Thermal Model Using Infrared Thermography.
| dc.contributor.author | Resch, C. | en_US |
| dc.contributor.author | Pecht, M. | en_US |
| dc.contributor.department | ISR | en_US |
| dc.date.accessioned | 2007-05-23T09:40:55Z | |
| dc.date.available | 2007-05-23T09:40:55Z | |
| dc.date.issued | 1988 | en_US |
| dc.description.abstract | The ability to accurately calculate the temperature profile of a printed wiring board (PWB) is necessary in determining the reliability of the PWB. Calculating temperatures of electronic components on PWBs requires that models be developed and tested for their validity. Infrared thermography provides one method of measuring the temperature profile of a PWB. Using an infrared camera, a thermal "snapshot" is taken of the PWB where the colors on the suapshot represent ranges of temperatures. The temperature profile of a conductively cooled PWB is modeled using the University of Maryland RAMCAD system and validated using both infrared thermography and thermocouples. The two sets of measurements are compared and the validity of using infrared thermography to determine the accuracy of a thermal model is discussed. | en_US |
| dc.format.extent | 238526 bytes | |
| dc.format.mimetype | application/pdf | |
| dc.identifier.uri | http://hdl.handle.net/1903/4751 | |
| dc.language.iso | en_US | en_US |
| dc.relation.ispartofseries | ISR; TR 1988-18 | en_US |
| dc.title | Validation of a Thermal Model Using Infrared Thermography. | en_US |
| dc.type | Technical Report | en_US |
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