Multi-Scale Dynamic Study of Secondary Impact During Drop Testing of Surface Mount Packages

dc.contributor.advisorDasgupta, Abhijiten_US
dc.contributor.authorMeng, Jingshien_US
dc.contributor.departmentMechanical Engineeringen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.description.abstractThis dissertation focuses on design challenges caused by secondary impacts to printed wiring assemblies (PWAs) within hand-held electronics due to accidental drop or impact loading. The continuing increase of functionality, miniaturization and affordability has resulted in a decrease in the size and weight of handheld electronic products. As a result, PWAs have become thinner and the clearances between surrounding structures have decreased. The resulting increase in flexibility of the PWAs in combination with the reduced clearances requires new design rules to minimize and survive possible internal collisions impacts between PWAs and surrounding structures. Such collisions are being termed ‘secondary impact’ in this study. The effect of secondary impact on board-level drop reliability of printed wiring boards (PWBs) assembled with MEMS microphone components, is investigated using a combination of testing, response and stress analysis, and damage modeling. The response analysis is conducted using a combination of numerical finite element modeling and simplified analytic models for additional parametric sensitivity studies.en_US
dc.subject.pqcontrolledMechanical engineeringen_US
dc.subject.pquncontrolledDamage Modelingen_US
dc.subject.pquncontrolledDrop Testsen_US
dc.subject.pquncontrolledElectronic Packagingen_US
dc.subject.pquncontrolledSecondary Impacten_US
dc.subject.pquncontrolledSurface Mounten_US
dc.titleMulti-Scale Dynamic Study of Secondary Impact During Drop Testing of Surface Mount Packagesen_US


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