Reliability evaluation of stacked die BGA assemblies under mechanical bending loads

dc.contributor.advisorPecht, Michael Gen_US
dc.contributor.authorSong , Boen_US
dc.contributor.departmentMechanical Engineeringen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.date.accessioned2007-02-01T20:23:16Z
dc.date.available2007-02-01T20:23:16Z
dc.date.issued2006-12-08en_US
dc.description.abstractThis thesis presents a reliability evaluation of stacked die ball grid array (BGA) assemblies under mechanical bending loads. The test specimens used in this investigation were four die stacked BGAs assembled on printed circuit boards (PCBs) with eutectic tin-lead solder and gold over nickel finishes, both as-reflowed and after aging. The failure envelopes of both types of specimen were quantified in terms of PCB flexural strain and strain rate. The experimental data from cyclic bending tests at three strain amplitudes with a constant strain rate have been used to determine the effect of strain amplitudes on cycles to failure. The experimental data from cyclic bending tests were combined with the data from impact tests to determine the effect of strain rate to cycles to failure. The failure sites associated with each test condition were identified, and failure site transition phenomena are reported and discussed.en_US
dc.format.extent3037822 bytes
dc.format.mimetypeapplication/pdf
dc.identifier.urihttp://hdl.handle.net/1903/4194
dc.language.isoen_US
dc.subject.pqcontrolledEngineering, Mechanicalen_US
dc.subject.pquncontrolledstacked die BGAen_US
dc.subject.pquncontrolledreliabilityen_US
dc.subject.pquncontrolledmechanical bending loadsen_US
dc.subject.pquncontrolledfailure site transitionen_US
dc.subject.pquncontrolledstrain amplitudeen_US
dc.subject.pquncontrolledstrain rateen_US
dc.titleReliability evaluation of stacked die BGA assemblies under mechanical bending loadsen_US
dc.typeThesisen_US

Files

Original bundle
Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
umi-umd-4001.pdf
Size:
2.9 MB
Format:
Adobe Portable Document Format