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Modeling the Fluid Dynamics of Electrowetting on Dielectric (EWOD)

dc.contributor.authorShapiro, Benjamin
dc.contributor.authorWalker, Shawn
dc.identifier.citationS.Walker, B.Shapiro. Modeling the Fluid Dynamics of Electro-Wetting On Dielectric (EWOD). Journal of Microelectromechanical Systems (JMEMS), vol 15, no 4, pg 986-1000, Aug 2006.en
dc.description.abstractThis paper discusses the modeling and simulation of a parallel-plate Electrowetting On Dielectric (EWOD) device that moves fluid droplets through surface tension effects.We model the fluid dynamics by using Hele–Shaw type equations with a focus on including the relevant boundary phenomena. Specifically, we show that contact angle saturation and hysteresis are needed to predict the correct shape and time scale of droplet motion.We demonstrate this by comparing our simulation to experimental data for a splitting droplet.Without these boundary effects, the simulation shows the droplet splitting into three pieces instead of two and the motion is over 15 times faster than the experiment. We then show how including the saturation characteristics of the device, and a simple model of contact angle hysteresis, allows the simulation to better predict the splitting experiment. The match is not perfect and suffers mainly because contact line pinning is not included. This is followed by a comparison between our simulation, whose parameters are now frozen, and a new experiment involving bulk droplet motion. Our numerical implementation uses the level set method, is fast, and is being used to design algorithms for the precise control of microdroplet motion, mixing, and splitting.en
dc.format.extent2654370 bytes
dc.subjectlevel set methoden
dc.subjecttwo-phase flowen
dc.titleModeling the Fluid Dynamics of Electrowetting on Dielectric (EWOD)en
dc.relation.isAvailableAtA. James Clark School of Engineeringen_us
dc.relation.isAvailableAtAerospace Engineeringen_us
dc.relation.isAvailableAtDigital Repository at the University of Marylanden_us
dc.relation.isAvailableAtUniversity of Maryland (College Park, MD)en_us
dc.rights.licenseCopyright © [2006] IEEE. Reprinted from JOURNAL OF MICROELECTROMECHANICAL SYSTEMS This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of the University of Maryland 's products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to By choosing to view this document, you agree to all provisions of the copyright laws protecting it.

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