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Development of a Test Methodology to Determine Dynamic Fracture Strength in Microfabricated MEMS Structures

dc.contributor.advisorBarker, Donalden_US
dc.contributor.authorEmmel, Rachel Laurenen_US
dc.date.accessioned2009-07-02T05:36:30Z
dc.date.available2009-07-02T05:36:30Z
dc.date.issued2009en_US
dc.identifier.urihttp://hdl.handle.net/1903/9126
dc.description.abstractAs micro-electro-mechanical systems (MEMS) are becoming more and more common in both military and consumer electronics, virtual qualification of these devices remains an important design tool. To model MEMS devices subjected to high shock loading, the dynamic fracture strength of the most widely used MEMS material, single crystal silicon (SCSi), is needed. Minimal research has been performed to determine this material property and the research that has been completed suggests that fracture strength varies considerably with processing parameters. Therefore, an efficient and inexpensive testing method to determine the dynamic fracture strength of processed SCSi has been developed. Experimentation with SCSi MEMS structures has also been carried out using this new testing method. A probabilistic Weibull distribution for bending of DRIE processed SCSi around the <110> directions was created as a design for reliability tool. Additional experiments demonstrated that the fracture strength for bending of DRIE processed SCSi around the <100> directions is greater than 1.1 GPa. Suggestions for subsequent work that focuses on the bending of SCSi around the <100> directions are also presented.en_US
dc.format.extent15772121 bytes
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.titleDevelopment of a Test Methodology to Determine Dynamic Fracture Strength in Microfabricated MEMS Structuresen_US
dc.typeThesisen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.contributor.departmentMechanical Engineeringen_US
dc.subject.pqcontrolledEngineering, Mechanicalen_US
dc.subject.pqcontrolledEngineering, Electronics and Electricalen_US
dc.subject.pquncontrolledDynamic Fracture Strengthen_US
dc.subject.pquncontrolledHigh Shock Loadingen_US
dc.subject.pquncontrolledMEMSen_US
dc.subject.pquncontrolledShock Testen_US
dc.subject.pquncontrolledSingle Crystal Siliconen_US


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