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dc.contributor.authorTrichur, Vinai S.en_US
dc.contributor.authorBall, Michael O.en_US
dc.contributor.authorBaras, John S.en_US
dc.contributor.authorHebbar, Kiranen_US
dc.contributor.authorMinis, Ioannisen_US
dc.contributor.authorNau, Dana S.en_US
dc.contributor.authorSmith, Stephen J.J.en_US
dc.date.accessioned2007-05-23T10:02:21Z
dc.date.available2007-05-23T10:02:21Z
dc.date.issued1996en_US
dc.identifier.urihttp://hdl.handle.net/1903/5793
dc.description.abstractPreviously, we have described two systems, EDAPS and EXTRA, which support design and process planning for the manufacture of microwave modules, complex devices with both electrical and mechanical attributes. EDAPS integrates electrical design, mechanical design, and process planning for both mechanical and electrical domains. EXTRA accesses various component and process databases to help the user define design and process options. It then supports the user in choosing among these options with an optimization bases tradeoff analysis module.<P>In this paper, we describe our current work towards the integration and enhancement of the capabilities of EDAPS and EXTRA. We integrate EXTRA's functionality with the initial design step of EDAPS. in the resultant system, the user, supported by an enhanced tradeoff analysis capability, can select and describe a promising preliminary design and process plan based on the analysis of a variety of alternatives from both an electrical and mechanical perspective. This preliminary design is then subjected top further analysis and refinement using existing EDAPS capabilities. In addition to the integration of these two systems, specific new functions have been developed, including tradeoff analysis over a much broader set of criteria, and the ability of the tradeoff module to query the process planner to determine costs of individual options.en_US
dc.format.extent1342335 bytes
dc.format.mimetypeapplication/pdf
dc.language.isoen_USen_US
dc.relation.ispartofseriesISR; TR 1996-78en_US
dc.subjectalgorithmsen_US
dc.subjectcombinatoricsen_US
dc.subjectdatabasesen_US
dc.subjectelectronic packagingen_US
dc.subjectmanufacturingen_US
dc.subjectmanufacturabilityen_US
dc.subjectinteger programmingen_US
dc.subjectIntelligent Signal Processing en_US
dc.subjectCommunications Systemsen_US
dc.titleIntegrating Tradeoff Analysis and Plan-Based Evaluation of Designs for Microwave Modulesen_US
dc.typeTechnical Reporten_US
dc.contributor.departmentISRen_US


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