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dc.contributor.advisorPecht, Michael Gen_US
dc.contributor.authorMahadeo, Dinesh Michaelen_US
dc.date.accessioned2015-06-25T05:45:15Z
dc.date.available2015-06-25T05:45:15Z
dc.date.issued2015en_US
dc.identifierhttps://doi.org/10.13016/M28339
dc.identifier.urihttp://hdl.handle.net/1903/16478
dc.description.abstractSulfur, present in the environment in the form of sulfur dioxide and hydrogen sulfide, can produce failure in electronics. In particular, copper, which is used extensively in electronic products, is subject to corrosion in the presence of sulfur. This thesis examines the corrosion of copper under the Flowers of Sulfur (FoS) test at varying temperatures and durations. The FoS test setup, described in ASTM B809, was initially designed to evaluate surface finish porosity, but this setup may have boarder application. To expand the applicability of the FoS test, it is important to characterize the test environment. To this end, a systematic study of copper corrosion was conducted through weight gain measurements of copper coupons that were subjected to FoS test environments. From the test results, a model was developed that correlates copper sulfide thickness to temperature and time under the FoS test. This model can be used to determine test conditions given a target field environment.en_US
dc.language.isoenen_US
dc.titleCOPPER CORROSION IN THE FLOWERS OF SULFER TEST ENVIRONMENTen_US
dc.typeThesisen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.contributor.departmentMechanical Engineeringen_US
dc.subject.pqcontrolledMechanical engineeringen_US
dc.subject.pquncontrolledCopperen_US
dc.subject.pquncontrolledCorrosionen_US
dc.subject.pquncontrolledElectronicsen_US
dc.subject.pquncontrolledFlowers of Sulfuren_US
dc.subject.pquncontrolledReliabilityen_US
dc.subject.pquncontrolledSulfuren_US


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