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    Effect of Palladium Thickness and Extended Isothermal Aging on the Reliability of Solder Interconnects Formed on ENEPIG Surface Finish

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    No. of downloads: 193

    Date
    2014
    Author
    Pearl, Adam Timothy
    Advisor
    Pecht, Michael
    Osterman, Michael
    DRUM DOI
    https://doi.org/10.13016/M29W3J
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    Abstract
    Surface finishes for copper on printed wiring boards play an important role in the reliability of electrical interconnects. Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG), developed in the mid-1990s to alleviate the "black-pad" problem created by Electroless Nickel/Immersion Gold (ENIG) surface finish, has gained interest for critical system applications. This thesis investigates the effect of palladium layer thickness and extended isothermal aging on the reliability of both tin-lead and tin silver copper solder interconnects under temperature cycling, vibration cycling, and drop loading conditions. Chip array ball grid array (CABGA) packages soldered onto ENEPIG-finished PCBs are subjected to the three previously listed conditions. Reliability and failure analyses are conducted to determine the overall effect of palladium layer thickness and isothermal aging on the reliability of these solder interconnects.
    URI
    http://hdl.handle.net/1903/15894
    Collections
    • Mechanical Engineering Theses and Dissertations
    • UMD Theses and Dissertations

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    DRUM is brought to you by the University of Maryland Libraries
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