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THERMAL CYCLING RELIABILITY OF LEAD-FREE SOLDERS (SAC305 AND SN3.5AG) FOR HIGH TEMPERATURE APPLICATIONS

dc.contributor.advisorPecht, Michael Gen_US
dc.contributor.authorGeorge, Elvizen_US
dc.date.accessioned2011-02-19T07:15:44Z
dc.date.available2011-02-19T07:15:44Z
dc.date.issued2010en_US
dc.identifier.urihttp://hdl.handle.net/1903/11272
dc.description.abstractEutectic tin lead was the most widely used solder interconnect in the electronics industry before the adoption of lead-free legislation. But eutectic tin lead solder has a low melting point (183<super>o</super>C) and was not suited for some high temperature applications, such as oil and gas exploration, automotive, and defense. Hence, for these applications, the electronics industry had to rely on specialized solders. In this study, ball grid arrays (BGAs), quad flat packages (QFPs), and surface mount resistors assembled with SAC305 and Sn3.5Ag solder pastes were subjected to thermal cycling from -40<super>o</super>C to 185<super>o</super>C. Commercially available electroless nickel immersion gold (ENIG) board finish was compared to proprietary Sn-based board finish designed for high temperatures. The data analysis showed that the type of solder paste and board finish used did not have an impact on the reliability of BGAs. The failure site was on the package side of the solder joint. The morphology of intermetallic compounds (IMCs) formed after thermal cycling was analyzed.en_US
dc.titleTHERMAL CYCLING RELIABILITY OF LEAD-FREE SOLDERS (SAC305 AND SN3.5AG) FOR HIGH TEMPERATURE APPLICATIONSen_US
dc.typeThesisen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.contributor.departmentMechanical Engineeringen_US
dc.subject.pqcontrolledMechanical Engineeringen_US
dc.subject.pquncontrolledBGA Packagesen_US
dc.subject.pquncontrolledElectronics Reliabilityen_US
dc.subject.pquncontrolledENIG Finishen_US
dc.subject.pquncontrolledHigh Temperatureen_US
dc.subject.pquncontrolledLead-free Soldersen_US
dc.subject.pquncontrolledThermal Cyclingen_US


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