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Modeling of a Single-Phase Liquid Cooling System for Power Electronics Applications

dc.contributor.advisorMcCluskey, F. Patricken_US
dc.contributor.authorDeVoto, Douglasen_US
dc.date.accessioned2011-02-19T07:12:32Z
dc.date.available2011-02-19T07:12:32Z
dc.date.issued2010en_US
dc.identifier.urihttp://hdl.handle.net/1903/11256
dc.description.abstractThis work investigates the reliability of a single-phase, liquid cooling system used for the thermal management of a medium power level converter system. The system utilizes a plastic insert cold plate design to provide even cooling over the backside of a power electronics device by directing coolant through parallel serpentine channels. Material selection and compression set testing evaluated suitable elastomers for seals and polymers for the plastic insert. Computational fluid dynamics software was used to evaluate the thermal performance of the cooling system under ideal conditions as well as various wear out conditions (e.g. channel blockage, erosion of channel walls). Properties of used 50/50 ethylene glycol water coolant were evaluated to discover additional causes of reduced thermal performance. After completing the cooling system evaluation under initial and degraded conditions, the impact on a power module's operating temperature was correlated to an estimation of the device's reliability.en_US
dc.titleModeling of a Single-Phase Liquid Cooling System for Power Electronics Applicationsen_US
dc.typeThesisen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.contributor.departmentMechanical Engineeringen_US
dc.subject.pqcontrolledMechanical Engineeringen_US
dc.subject.pquncontrolledpower electronicsen_US
dc.subject.pquncontrolledreliabilityen_US
dc.subject.pquncontrolledsingle-phase liquid coolingen_US


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