A. James Clark School of Engineering
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The collections in this community comprise faculty research works, as well as graduate theses and dissertations.
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Item ENABLING HARDWARE TECHNOLOGIES FOR AUTONOMY IN TINY ROBOTS: CONTROL, INTEGRATION, ACTUATION(2016) Lee, Tsung-Hsueh; Abshire, Pamela A; Electrical Engineering; Digital Repository at the University of Maryland; University of Maryland (College Park, Md.)The last two decades have seen many exciting examples of tiny robots from a few cm3 to less than one cm3. Although individually limited, a large group of these robots has the potential to work cooperatively and accomplish complex tasks. Two examples from nature that exhibit this type of cooperation are ant and bee colonies. They have the potential to assist in applications like search and rescue, military scouting, infrastructure and equipment monitoring, nano-manufacture, and possibly medicine. Most of these applications require the high level of autonomy that has been demonstrated by large robotic platforms, such as the iRobot and Honda ASIMO. However, when robot size shrinks down, current approaches to achieve the necessary functions are no longer valid. This work focused on challenges associated with the electronics and fabrication. We addressed three major technical hurdles inherent to current approaches: 1) difficulty of compact integration; 2) need for real-time and power-efficient computations; 3) unavailability of commercial tiny actuators and motion mechanisms. The aim of this work was to provide enabling hardware technologies to achieve autonomy in tiny robots. We proposed a decentralized application-specific integrated circuit (ASIC) where each component is responsible for its own operation and autonomy to the greatest extent possible. The ASIC consists of electronics modules for the fundamental functions required to fulfill the desired autonomy: actuation, control, power supply, and sensing. The actuators and mechanisms could potentially be post-fabricated on the ASIC directly. This design makes for a modular architecture. The following components were shown to work in physical implementations or simulations: 1) a tunable motion controller for ultralow frequency actuation; 2) a nonvolatile memory and programming circuit to achieve automatic and one-time programming; 3) a high-voltage circuit with the highest reported breakdown voltage in standard 0.5 μm CMOS; 4) thermal actuators fabricated using CMOS compatible process; 5) a low-power mixed-signal computational architecture for robotic dynamics simulator; 6) a frequency-boost technique to achieve low jitter in ring oscillators. These contributions will be generally enabling for other systems with strict size and power constraints such as wireless sensor nodes.Item Electro-Thermal Codesign in Liquid Cooled 3D ICs: Pushing the Power-Performance Limits(2013) Shi, Bing; Srivastava, Ankur; Electrical Engineering; Digital Repository at the University of Maryland; University of Maryland (College Park, Md.)The performance improvement of today's computer systems is usually accompanied by increased chip power consumption and system temperature. Modern CPUs dissipate an average of 70-100W power while spatial and temporal power variations result in hotspots with even higher power density (up to 300W/cm^2). The coming years will continue to witness a significant increase in CPU power dissipation due to advanced multi-core architectures and 3D integration technologies. Nowadays the problems of increased chip power density, leakage power and system temperatures have become major obstacles for further improvement in chip performance. The conventional air cooling based heat sink has been proved to be insufficient for three dimensional integrated circuits (3D-ICs). Hence better cooling solutions are necessary. Micro-fluidic cooling, which integrates micro-channel heat sinks into silicon substrates of the chip and uses liquid flow to remove heat inside the chip, is an effective active cooling scheme for 3D-ICs. While the micro-fluidic cooling provides excellent cooling to 3D-ICs, the associated overhead (cooling power consumed by the pump to inject the coolant through micro-channels) is significant. Moreover, the 3D-IC structure also imposes constraints on micro-channel locations (basically resource conflict with through-silicon-vias TSVs or other structures). In this work, we investigate optimized micro-channel configurations that address the aforementioned considerations. We develop three micro-channel structures (hotspot optimized cooling configuration, bended micro-channel and hybrid cooling network) that can provide sufficient cooling to 3D-IC with minimum cooling power overhead, while at the same time, compatible with the existing electrical structure such as TSVs. These configurations can achieve up to 70% cooling power savings compared with the configuration without any optimization. Based on these configurations, we then develop a micro-fluidic cooling based dynamic thermal management approach that maintains the chip temperature through controlling the fluid flow rate (pressure drop) through micro-channels. These cooling configurations are designed after the electrical parts, and therefore, compatible with the current standard IC design flow. Furthermore, the electrical, thermal, cooling and mechanical aspects of 3D-IC are interdependent. Hence the conventional design flow that designs the cooling configuration after electrical aspect is finished will result in inefficiencies. In order to overcome this problem, we then investigate electrical-thermal co-design methodology for 3D-ICs. Two co-design problems are explored: TSV assignment and micro-channel placement co-design, and gate sizing and fluidic cooling co-design. The experimental results show that the co-design enables a fundamental power-performance improvement over the conventional design flow which separates the electrical and cooling design. For example, the gate sizing and fluidic cooling co-design achieves 12% power savings under the same circuit timing constraint and 16% circuit speedup under the same power budget.Item Low Power Adaptive Circuits: An Adaptive Log Domain Filter and A Low Power Temperature Insensitive Oscillator Applied in Smart Dust Radio(2010) Zhai, Yiming; Goldsman, Neil; Electrical Engineering; Digital Repository at the University of Maryland; University of Maryland (College Park, Md.)This dissertation focuses on exploring two low power adaptive circuits. One is an adaptive filter at audio frequency for system identification. The other is a temperature insensitive oscillator for low power radio frequency communication. The adaptive filter is presented with integrated learning rules for model reference estimation. The system is a first order low pass filter with two parameters: gain and cut-off frequency. It is implemented using multiple input floating gate transistors to realize online learning of system parameters. Adaptive dynamical system theory is used to derive robust control laws in a system identification task. Simulation results show that convergence is slower using simplified control laws but still occurs within milliseconds. Experimental results confirm that the estimated gain and cut-off frequency track the corresponding parameters of the reference filter. During operation, deterministic errors are introduced by mismatch within the analog circuit implementation. An analysis is presented which attributes the errors to current mirror mismatch. The harmonic distortion of the filter operating in different inversion is analyzed using EKV model numerically. The temperature insensitive oscillator is designed for a low power wireless network. The system is based on a current starved ring oscillator implemented using CMOS transistors instead of LC tank for less chip area and power consumption. The frequency variance with temperature is compensated by the temperature adaptive circuits. Experimental results show that the frequency stability from 5°C to 65°C has been improved 10 times with automatic compensation and at least 1 order less power is consumed than published competitors. This oscillator is applied in a 2.2GHz OOK transmitter and a 2.2GHz phase locked loop based FM receiver. With the increasing needs of compact antenna, possible high data rate and wide unused frequency range of short distance communication, a higher frequency phase locked loop used for BFSK receiver is explored using an LC oscillator for its capability at 20GHz. The success of frequency demodulation is demonstrated in the simulation results that the PLL can lock in 0.5μs with 35MHz lock-in range and 2MHz detection resolution. The model of a phase locked loop used for BFSK receiver is analyzed using Matlab.Item Design Space Re-Engineering for Power Minimization in Modern Embedded Systems(2006-06-01) Yuan, Lin; Qu, Gang; Electrical Engineering; Digital Repository at the University of Maryland; University of Maryland (College Park, Md.)Power minimization is a critical challenge for modern embedded system design. Recently, due to the rapid increase of system's complexity and the power density, there is a growing need for power control techniques at various design levels. Meanwhile, due to technology scaling, leakage power has become a significant part of power dissipation in the CMOS circuits and new techniques are needed to reduce leakage power. As a result, many new power minimization techniques have been proposed such as voltage island, gate sizing, multiple supply and threshold voltage, power gating and input vector control, etc. These design options further enlarge the design space and make it prohibitively expensive to explore for the most energy efficient design solution. Consequently, heuristic algorithms and randomized algorithms are frequently used to explore the design space, seeking sub-optimal solutions to meet the time-to-market requirements. These algorithms are based on the idea of truncating the design space and restricting the search in a subset of the original design space. While this approach can effectively reduce the runtime of searching, it may also exclude high-quality design solutions and cause design quality degradation. When the solution to one problem is used as the base for another problem, such solution quality degradation will accumulate. In modern electronics system design, when several such algorithms are used in series to solve problems in different design levels, the final solution can be far off the optimal one. In my Ph.D. work, I develop a {\em re-engineering} methodology to facilitate exploring the design space of power efficient embedded systems design. The direct goal is to enhance the performance of existing low power techniques. The methodology is based on the idea that design quality can be improved via iterative ``re-shaping'' the design space based on the ``bad'' structure in the obtained design solutions; the searching run-time can be reduced by the guidance from previous exploration. This approach can be described in three phases: (1) apply the existing techniques to obtain a sub-optimal solution; (2) analyze the solution and expand the design space accordingly; and (3) re-apply the technique to re-explore the enlarged design space. We apply this methodology at different levels of embedded system design to minimize power: (i) switching power reduction in sequential logic synthesis; (ii) gate-level static leakage current reduction; (iii) dual threshold voltage CMOS circuits design; and (iv) system-level energy-efficient detection scheme for wireless sensor networks. An extensive amount of experiments have been conducted and the results have shown that this methodology can effectively enhance the power efficiency of the existing embedded system design flows with very little overhead.