Theses and Dissertations from UMD
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Item Anisotropic Multi-scale Modeling for Steady-state Creep Behavior of Oligocrystalline SnAgCu (SAC) Solder Joints(2021) Jiang, Qian; Dasgupta, Abhijit; Mechanical Engineering; Digital Repository at the University of Maryland; University of Maryland (College Park, Md.)Heterogeneous integration is leading to unprecedented miniaturization of solder joints. The overall size of solder interconnections in current-generation microelectronics assemblies has length-scales that are comparable to that of the intrinsic heterogeneities of the solder microstructure. In particular, there are only a few highly anisotropic grains in each joint. This makes the mechanical response of each joint quite unique. Rigorous mechanistic approaches are needed for quantitative understanding of the response of such joints, based on the variability of the microstructural morphology. The discrete grain morphology of as-solidified oligocrystalline SAC (SnAgCu) solder joints is explicitly modeled in terms of multiple length scales (four tiers of length scales are used in the description here). At the highest length-scale in the joint (Tier 3), there are few highly anisotropic viscoplastic grains in each functional solder joint, connected by visoplastic grain boundaries. At the next lower tier (Tier 2), the primary heterogeneity within each grain is due to individual dendrites of pro-eutectic β-Sn. Additional microscale intermetallic compounds of Cu6Sn5 rods are located inside individual grains. Packed between the dendrite lobes is a eutectic Ag-Sn alloy, The next lower length-scale (Tier 1), deals with the microstructure of the Ag-Sn eutectic phase, consisting of nanoscale Ag3Sn IMC particles dispersed in a β-Sn matrix. The characteristic length scale and spacing of the IMC particles in this eutectic mix are important features of Tier 1. Tier 0 refers to the body-centered tetragonal (BCT) anisotropic β-Sn crystal structure, including the dominant slip systems for this crystal system. The objective of this work is to provide the mechanistic framework to quantify the mechanical viscoplastic response of such solder joints. The anisotropic mechanical behavior of each solder grain is modeled with a multiscale crystal viscoplasticity (CV) approach, based on anisotropic dislocation mechanics and typical microstructural features of SAC crystals. Model constants are calibrated with single crystal data from the literature and from experiments. This calibrated CV model is used as single-crystal digital twin, for virtual tests to determine the model constants for a continuum-scale compact anisotropic creep model for SAC single crystals, based on Hill’s anisotropic potential and an associated creep flow-rule. The additional contribution from grain boundary sliding, for polycrystalline structures, is investigated by the use of a grain-boundary phase, and the properties of the grain boundary phase are parametrically calibrated by comparing the model results with creep test results of joint-scale few-grained solder specimens. This methodology enables user-friendly computationally efficient finite element simulations of multi-grain solder joints in microelectronic assemblies and facilitates parametric sensitivity studies of different grain configurations. This proposed grain-scale modeling approach is explicitly sensitive to microstructural features such as the morphology of: (i) the IMC reinforcements in the eutectic phase; (ii) dendrites; and (iii) grains. Thus, this model is suited for studying the effect of microstructural tailoring and microstructural evolution. The developed multiscale modeling methodology will also empower designers to numerically explore the worst-case and best-case microstructural configurations (and corresponding stochastic variabilities in solder joint performance and in design margins) for creep deformation under monotonic loading, for creep-fatigue under thermal cycling as well as for creep properties under isothermal aging conditions.Item MEMS SENSOR PLATFORMS FOR IN SITU CHARACTERIZATION OF LI-ION BATTERY ELECTRODES(2016) Jung, Hyun; Ghodssi, Reza; Electrical Engineering; Digital Repository at the University of Maryland; University of Maryland (College Park, Md.)Lithium-ion batteries provide high energy density while being compact and light-weight and are the most pervasive energy storage technology powering portable electronic devices such as smartphones, laptops, and tablet PCs. Considerable efforts have been made to develop new electrode materials with ever higher capacity, while being able to maintain long cycle life. A key challenge in those efforts has been characterizing and understanding these materials during battery operation. While it is generally accepted that the repeated strain/stress cycles play a role in long-term battery degradation, the detailed mechanisms creating these mechanical effects and the damage they create still remain unclear. Therefore, development of techniques which are capable of capturing in real time the microstructural changes and the associated stress during operation are crucial for unravelling lithium-ion battery degradation mechanisms and further improving lithium-ion battery performance. This dissertation presents the development of two microelectromechanical systems sensor platforms for in situ characterization of stress and microstructural changes in thin film lithium-ion battery electrodes, which can be leveraged as a characterization platform for advancing battery performance. First, a Fabry-Perot microelectromechanical systems sensor based in situ characterization platform is developed which allows simultaneous measurement of microstructural changes using Raman spectroscopy in parallel with qualitative stress changes via optical interferometry. Evolutions in the microstructure creating a Raman shift from 145 cm−1 to 154 cm−1 and stress in the various crystal phases in the LixV2O5 system are observed, including both reversible and irreversible phase transitions. Also, a unique way of controlling electrochemically-driven stress and stress gradient in lithium-ion battery electrodes is demonstrated using the Fabry-Perot microelectromechanical systems sensor integrated with an optical measurement setup. By stacking alternately stressed layers, the average stress in the stacked electrode is greatly reduced by 75% compared to an unmodified electrode. After 2,000 discharge-charge cycles, the stacked electrodes retain only 83% of their maximum capacity while unmodified electrodes retain 91%, illuminating the importance of the stress gradient within the electrode. Second, a buckled membrane microelectromechanical systems sensor is developed to enable in situ characterization of quantitative stress and microstructure evolutions in a V2O5 lithium-ion battery cathode by integrating atomic force microscopy and Raman spectroscopy. Using dual-mode measurements in the voltage range of the voltage range of 2.8V – 3.5V, both the induced stress (~ 40 MPa) and Raman intensity changes due to lithium cycling are observed. Upon lithium insertion, tensile stress in the V2O5 increases gradually until the α- to ε-phase and ε- to δ-phase transitions occur. The Raman intensity change at 148 cm−1 shows that the level of disorder increases during lithium insertion and progressively recovers the V2O5 lattice during lithium extraction. Results are in good agreement with the expected mechanical behavior and disorder change in V2O5, highlighting the potential of microelectromechanical systems as enabling tools for advanced scientific investigations. The work presented here will be eventually utilized for optimization of thin film battery electrode performance by achieving fundamental understanding of how stress and microstructural changes are correlated, which will also provide valuable insight into a battery performance degradation mechanism.Item Geodynamic Simulations using the Fast Multipole Boundary Element Method(2014) Drombosky, Tyler William; Hier-Majumder, Saswata; Applied Mathematics and Scientific Computation; Digital Repository at the University of Maryland; University of Maryland (College Park, Md.)Interaction between viscous fluids models two important phenomena in geophysics: (i) the evolution of partially molten rocks, and (ii) the dynamics of Ultralow-Velocity Zones. Previous attempts to numerically model these behaviors have been plagued either by poor resolution at the fluid interfaces or high computational costs. We employ the Fast Multipole Boundary Element Method, which tracks the evolution of the fluid interfaces explicitly and is scalable to large problems, to model these systems. The microstructure of partially molten rocks strongly influences the macroscopic physical properties. The fractional area of intergranular contact, contiguity, is a key parameter that controls the elastic strength of the grain network in the partially molten aggregate. We study the influence of matrix deformation on the contiguity of an aggregate by carrying out pure shear and simple shear deformations of an aggregate. We observe that the differential shortening, the normalized difference between the major and minor axes of grains is inversely related to the ratio between the principal components of the contiguity tensor. From the numerical results, we calculate the seismic anisotropy resulting from melt redistribution during pure and simple shear deformation. During deformation, the melt is expelled from tubules along three grain corners to films along grain edges. The initially isotropic fractional area of intergranular contact, contiguity, becomes anisotropic due to deformation. Consequently, the component of contiguity evaluated on the plane parallel to the axis of maximum compressive stress decreases. We demonstrate that the observed global shear wave anisotropy and shear wave speed reduction of the Lithosphere-Asthenosphere Boundary are best explained by 0.1 vol\% partial melt distributed in horizontal films created by deformation. We use our microsimulation in conjunction with a large scale mantle deep Earth simulation to gain insight into the formation of anisotropy within dense and transient regions known as Ultralow-Velocity Zones, where there is an observed slowdown of shear waves. The results demonstrate a geometric steady state of the dynamic reservoirs by mechanical processes. Within the steady state Ultralow-Velocity Zones, we find significant anisotropy that can explain the speed reduction in shear waves passing through the region.Item MICROSTRUCTURAL CHARACTERIZATION AND THERMAL CYCLING RELIABILITY OF SOLDERS UNDER ISOTHERMAL AGING AND ELECTRICAL CURRENT(2012) Chauhan, Preeti; Pecht, Michael G; Mechanical Engineering; Digital Repository at the University of Maryland; University of Maryland (College Park, Md.)Solder joints on printed circuit boards provide electrical and mechanical connections between electronic devices and metallized patterns on boards. These solder joints are often the cause of failure in electronic packages. Solders age under storage and operational life conditions, which can include temperature, mechanical loads, and electrical current. Aging occurring at a constant temperature is called isothermal aging. Isothermal aging leads to coarsening of the bulk microstructure and increased interfacial intermetallic compounds at the solder-pad interface. The coarsening of the solder bulk degrades the creep properties of solders, whereas the voiding and brittleness of interfacial intermetallic compounds leads to mechanical weakness of the solder joint. Industry guidelines on solder interconnect reliability test methods recommend preconditioning the solder assemblies by isothermal aging before conducting reliability tests. The guidelines assume that isothermal aging simulates a "reasonable use period," but do not relate the isothermal aging levels with specific use conditions. Studies on the effect of isothermal aging on the thermal cycling reliability of tin-lead and tin-silver-copper solders are limited in scope, and results have been contradictory. The effect of electrical current on solder joints has been has mostly focused on current densities above 104A/cm2 with high ambient temperature (≥100oC), where electromigration, thermomigration, and Joule heating are the dominant failure mechanisms. The effect of current density below 104A/cm2 on temperature cycling fatigue of solders has not been established. This research provides the relation between isothermal aging and the thermal cycling reliability of select Sn-based solders. The Sn-based solders with 3%, 1%, and 0% silver content that have replaced tin-lead are studied and compared against tin-lead solder. The activation energy and growth exponents of the Arrhenius model for the intermetallic growth in the solders are provided. An aging metric to quantify the aging of solder joints, in terms of phase size in the solder bulk and interfacial intermetallic compound thickness at the solder-pad interface, is established. Based on the findings of thermal cycling tests on aged solder assemblies, recommendations are made for isothermal aging of solders before thermal cycling tests. Additionally, the effect of active electrical current at 103 A/cm2 on thermal cycling reliability is reported.Item A Semianalytical, Three Dimensional Model of Microstructure in Multiparticle, Multiphase Flow(2011) Wimert, Jesse Tyler; Hier-Majumder, Saswata; Geology; Digital Repository at the University of Maryland; University of Maryland (College Park, Md.)This dissertation presents a three dimensional microgeodynamic model of grain-melt geometry in partially molten rocks. The isotropic unit cell of the partially molten rock is characterized by a face-centered-cubic symmetry, consisting of rhombic dodecahedral grains. The variation of surface tension between grain-grain and grain-melt contacts excites a coupled viscous flow within grains and the interstitial melt leading to a steady-state grain-melt geometry. The fractional area of intergranular contact, contiguity, is obtained from these models as a function of melt volume fraction, for melt fractions between 0.05 and 0.25. Comparison with previous results indicates that the contiguity in three dimensional models is lower than two dimensional models. We apply our model to the UltraLow Velocity Zones (ULVZ) in the Earth's core-mantle boundary. The observed seismic signature of the ULVZ can be explained by a melt volume fraction between 0.08 and 0.12.