Sequencing Wafer Handler Moves to Improve the Performance of Hybrid Cluster Tools

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dc.contributor.authorNguyen, Manh-Quan T.en_US
dc.contributor.authorHerrmann, Jeffrey W.en_US
dc.contributor.departmentISRen_US
dc.date.accessioned2007-05-23T10:09:23Z
dc.date.available2007-05-23T10:09:23Z
dc.date.issued2000en_US
dc.description.abstractCluster tools are highly integrated machines that can perform a sequence of semiconductor manufacturing processes. The sequence of wafer handler moves affects the total time needed to process a set of wafers.<p> Reducing this time can reduce cycle time, reduce tool utilization, and increase tool capacity. This paper introduces the cluster tool scheduling problem for hybrid cluster tools, which are multiple-stage tools that have at least one stage with two or more parallel chambers. <p>This paper presents algorithms that can find superior sequences of wafer handler moves. Experimental results show that the tool performance can be improved significantly if the wafer handler follows a cyclic sequence instead of using a dispatching rule.en_US
dc.format.extent400022 bytes
dc.format.mimetypeapplication/pdf
dc.identifier.urihttp://hdl.handle.net/1903/6134
dc.language.isoen_USen_US
dc.relation.ispartofseriesISR; TR 2000-31en_US
dc.subjectcomputer integrated manufacturing CIMen_US
dc.subjectflexible manufacturingen_US
dc.subjectmanufacturingen_US
dc.subjectcluster toolsen_US
dc.subjectschedulingen_US
dc.subjectsemiconductor manufacturing,en_US
dc.titleSequencing Wafer Handler Moves to Improve the Performance of Hybrid Cluster Toolsen_US
dc.typeTechnical Reporten_US

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