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dc.contributor.advisorYang, Baoen_US
dc.contributor.advisorBar-Cohen, Avramen_US
dc.contributor.authorYuruker, Sevket Umuten_US
dc.date.accessioned2017-09-14T05:50:55Z
dc.date.available2017-09-14T05:50:55Z
dc.date.issued2017en_US
dc.identifierdoi:10.13016/M2222R64F
dc.identifier.urihttp://hdl.handle.net/1903/20047
dc.description.abstractOn-chip thermoelectric cooling is a promising solution for thermal management of next generation integrated circuits. This thesis focuses on three thermoelectric cooling applications for high flux electronics. A micro contact enhanced thin film thermoelectric cooler was designed for remediation of a 5kW/cm2 hotspot and its integration with manifold microchannel system is numerically demonstrated. In addition, thermoelectric cooling was utilized for thermal de-coupling of electronic chips with different operating temperatures, eliminating the need to over-cool the entire package. Furthermore, effect of decreasing contact resistances in thin film thermoelectrics was numerically investigated to effectively remove 100W (~280W/cm2) of heat dissipation from quantum cascade lasers. Finally, a system-level optimization methodology is established with comprehensive mathematical modeling, verified with numerical simulations. Master curves are generated to understand the effect of system-level parasitics on performance and optimal design variables. In conclusion, the advantages of thermoelectric cooling for high flux electronics is demonstrated in this thesis.en_US
dc.language.isoenen_US
dc.titleTHERMOELECTRIC COOLING OF HIGH FLUX ELECTRONICSen_US
dc.typeThesisen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.contributor.departmentMechanical Engineeringen_US
dc.subject.pqcontrolledMechanical engineeringen_US
dc.subject.pquncontrolledHigh Flux Electronicsen_US
dc.subject.pquncontrolledHotspot Coolingen_US
dc.subject.pquncontrolledMicro-channel Coolingen_US
dc.subject.pquncontrolledOptimizationen_US
dc.subject.pquncontrolledThermal Managementen_US
dc.subject.pquncontrolledThermoelectric Coolingen_US


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