A THERMOMECHANICAL FATIGUE LIFE PREDICTION METHODOLOGY FOR BALL GRID ARRAY COMPONENTS WITH REWORKABLE UNDERFILL

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dc.contributor.advisorMcCluskey, Patricken_US
dc.contributor.authorSerebreni, Maximen_US
dc.contributor.departmentMechanical Engineeringen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.date.accessioned2019-10-01T05:36:39Z
dc.date.available2019-10-01T05:36:39Z
dc.date.issued2019en_US
dc.description.abstractUnderfill materials were originally developed to improve the thermo-mechanical reliability of flip-chip devices due to the large coefficient of thermal expansion (CTE) mismatch between the silicon die and substrate. More recently, underfill materials, specifically reworkable underfills, have been used to improve reliability of second level interconnects in ball grid array (BGA) packages in harsh end-use environments such as automotive, military and aerospace. In these environments, electronic components are exposed to mechanical shock, vibration, and large fluctuations in temperatures. Although reworkable underfills improve the reliability of BGA components under mechanical shock and vibration, some reworkable underfills have been shown to reduce reliability during thermal cycling environments. Consequently, this research employs experimental and numerical approaches to investigate the impact of reworkable underfill materials on thermomechanical fatigue life of solder joints in BGA packages. In the first section of the analysis, material characterization of a reworkable underfill is performed to determine appropriate material models for reworkable underfills. In the second analysis section, a variety of underfill materials with different properties are exposed to harsh and benign thermal cycles to determine the stress state responsible for reducing fatigue life of solder joints in BGA packages. In the final analysis section, simulations are performed on the BGAs with reworkable underfill to develop a fatigue life predication methodology that implements a modified mode separation scheme. The model developed in this work provides a working fatigue life approach for BGA packages with reworkable underfills exposed to thermal loading. The results of this study can be utilized by the automotive, military, and aerospace industries to optimize underfill material selection process and provide reliability assessment of BGA components in real world environments.en_US
dc.identifierhttps://doi.org/10.13016/dxo0-ijg8
dc.identifier.urihttp://hdl.handle.net/1903/25116
dc.language.isoenen_US
dc.subject.pqcontrolledMechanical engineeringen_US
dc.subject.pqcontrolledPackagingen_US
dc.subject.pquncontrolledBall grid Arrayen_US
dc.subject.pquncontrolledSolder Fatigueen_US
dc.subject.pquncontrolledThermal Cyclingen_US
dc.subject.pquncontrolledUnderfillen_US
dc.titleA THERMOMECHANICAL FATIGUE LIFE PREDICTION METHODOLOGY FOR BALL GRID ARRAY COMPONENTS WITH REWORKABLE UNDERFILLen_US
dc.typeDissertationen_US

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