FABRICATION AND MODELING OF SILICON CARBIDE BIPOLAR JUNCTION TRANSISTORS
| dc.contributor.advisor | Goldsman, Neil | en_US |
| dc.contributor.author | Geil, Bruce | en_US |
| dc.contributor.department | Electrical Engineering | en_US |
| dc.contributor.publisher | Digital Repository at the University of Maryland | en_US |
| dc.contributor.publisher | University of Maryland (College Park, Md.) | en_US |
| dc.date.accessioned | 2008-06-20T05:39:19Z | |
| dc.date.available | 2008-06-20T05:39:19Z | |
| dc.date.issued | 2008-05-06 | en_US |
| dc.description.abstract | The fabrication and modeling of Silicon Carbide (SiC) Bipolar Junction Transistors (BJT) and diodes for the development of high temperature power switches is presented. Silicon carbide processing including etching, implantation and ohmic contact fabrication are discussed. A 1-D computer model for SiC devices is developed that allows for temperature dependent calculations of current and potential in the device. The techniques that provide a unique ability to use either standard methods or the quasi Fermi method are provided. The modeled results are compared to experimental data and show very close correlation at room temperature but rapidly diverge at higher temperatures. Several temperature dependent variables that affect the model results are investigated to determine which calculations, if modified, would most improve the model accuracy. A perspective for future optimization of the model is given with an emphasis on the ability to calculate BJT currents. | en_US |
| dc.format.extent | 2859093 bytes | |
| dc.format.mimetype | application/pdf | |
| dc.identifier.uri | http://hdl.handle.net/1903/8244 | |
| dc.language.iso | en_US | |
| dc.subject.pqcontrolled | Engineering, Electronics and Electrical | en_US |
| dc.subject.pqcontrolled | Engineering, Electronics and Electrical | en_US |
| dc.title | FABRICATION AND MODELING OF SILICON CARBIDE BIPOLAR JUNCTION TRANSISTORS | en_US |
| dc.type | Thesis | en_US |
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