PROBABILISTIC PHYSICS OF FAILURE ASSESSMENT OF THERMOMECHANICAL FATIGUE IN HIGH-I/O AREA-ARRAY INTERCONNECTS

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dc.contributor.advisorDasgupta, Abhijiten_US
dc.contributor.authorRoettele, Shaughn Michaelen_US
dc.contributor.departmentMechanical Engineeringen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.date.accessioned2009-10-06T05:30:33Z
dc.date.available2009-10-06T05:30:33Z
dc.date.issued2009en_US
dc.description.abstractThermal cycling durability of Plastic ball grid array (PBGA) interconnects is known to decrease as I/O count increases. This is due, in part, to mechanistic effects; such as increasing thermal expansion mismatches between component and PWB, due to increasing package sizes. Failure prediction due to these mechanistic effects is a deterministic process and is based on the load level found in the critical joint (joint with the most severe loading). However, due to probabilistic effects, for example manufacturing variabilities, premature failure may result in one of several joints in the neighborhood of the critical one. Failure probability increases as the number of joints in this critical region increases. Thus, observed failure rates are due to a convolution of deterministic and probabilistic effects. In effect, for large BGAs, deterministic predictions may overestimate interconnect durability. This thesis uses thermal cycling experiments and detailed mechanistic modeling to present a methodology for adjusting deterministic predictions of solder joint failure with a suitable probabilistic correction factor.en_US
dc.format.extent3976435 bytes
dc.format.mimetypeapplication/pdf
dc.identifier.urihttp://hdl.handle.net/1903/9443
dc.language.isoen_US
dc.subject.pqcontrolledEngineering, Mechanicalen_US
dc.subject.pquncontrolledbgaen_US
dc.subject.pquncontrolledelectronic packagingen_US
dc.subject.pquncontrolledreliabilityen_US
dc.subject.pquncontrolledsolderen_US
dc.titlePROBABILISTIC PHYSICS OF FAILURE ASSESSMENT OF THERMOMECHANICAL FATIGUE IN HIGH-I/O AREA-ARRAY INTERCONNECTSen_US
dc.typeThesisen_US

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