Reliability Optimization Schemes for Convectively Cooled PCBs.

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dc.contributor.authorDancer, Daviden_US
dc.contributor.authorPecht, M.en_US
dc.contributor.authorPaimer, M.en_US
dc.contributor.departmentISRen_US
dc.date.accessioned2007-05-23T09:34:46Z
dc.date.available2007-05-23T09:34:46Z
dc.date.issued1986en_US
dc.description.abstractThis article discusses the optimum placement of a single row of convectively cooled electronic components In order to reduce failures. It is shown that this problem is analogous to the classical operations research problem of the optimum time scheduling of n jobs on a single machine, where for each job there is a time dependent completion penalty. Several optimization schemes for solving the idealized problem are compared as to their accuracy and computational speed. For the dynamic programming scheme a new compact labeling procedure is proposed.en_US
dc.format.extent177877 bytes
dc.format.mimetypeapplication/pdf
dc.identifier.urihttp://hdl.handle.net/1903/4429
dc.language.isoen_USen_US
dc.relation.ispartofseriesISR; TR 1986-3en_US
dc.titleReliability Optimization Schemes for Convectively Cooled PCBs.en_US
dc.typeTechnical Reporten_US

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