Chang, Hsiao-YungAdomaitis, Raymond A.Kidder, John N., Jr.Rubloff, Gary W.Experimental measurements of wafer temperature in a single-wafer,lamp-heated CVD system were used to study the wafer temperature responseto gas composition. A physically based simulation procedure for theprocess gas and wafer temperature was developed in which a subset ofparameter values were estimated using a nonlinear, iterative parameteridentification method, producing a validated model with true predictivecapabilities. <p>With process heating lamp power held constant, wafertemperature variations of up to 160 degrees K were observed by varying feed gasH_2/N_2 ratio. Heat transfer between the wafer and susceptor wasstudied by shifting the instrumented wafer off the susceptor axis,exposing a portion of the wafer backside to the chamber floor. Modelpredictions and experimental observations both demonstrated that the gasvelocity field had little influence on the observed wafer and predictedgas temperatures.en-USchemical process controldistributed parameter systemschemical vapor depositionsemiconductor manufacturingparameter identificationmodel validationIntelligent Control SystemsTechnical Report